Adhering process for encapsulated LED
A process and glue technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of difficult comparison of glue volume, etc., and achieve the effects of easy mastery, process saving, simple and quick operation
Inactive Publication Date: 2009-03-25
Shandong Huaguang Optoelectronics Co. Ltd.
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Problems solved by technology
The existing viscose process is generally operated by machines, so there is one more process, and the amount of glue is not easy to compare
Method used
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[0014] Taking the mold bar with a diameter of 5 mm and the bracket of 03RD as an example, the LED gluing process of the present invention will be described with reference to the accompanying drawings. Complete the front-end process according to the conventional process of LED packaging. After the solid crystal and wire bonding are completed, follow the steps below for gluing.
[0015] (1) Put mold strip 1 into the oven half an hour in advance, and set the temperature at 130°C to preheat.
[0016] (2) Epoxy resin is mixed according to the mass mixing ratio of A:B=4:5 (A is the main agent of epoxy resin, B is the hardener), stirred evenly, and vacuumed at 60°C.
[0017] The existing general process is to mix according to the mass mixing ratio of A:B=1:1. In this case, air bubbles are easy to occur. If there is too much A, it will not dry after baking, and too much B will easily make the colloid turn yellow, but there are few air bubbles. It is more suitable when the mass ratio ...
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The invention provides a gluing technology for packaging an LED. The gluing technology comprises the following steps: (1) a model strip is pre-heated for half an hour at 130 DEG C; (2) an epoxy resin main agent and a hardening agent are mixed according to the mass ratio A:B to be 4:5, mixed uniformly and vacuumized; (3) a bracket is pre-heated for 20min at 80 DEG C; (4) a hot model particle hole of the pre-heated model strip is filled with the prepared epoxy resin; and (5) the pre-heated bracket at 80 DEG C is taken out from an oven, and lies on the outside of the model strip to enable a bowl cup to extend into the model particle hole of the pre-heated model strip until the whole bowl cup is merged into the model particle hole, and then the model strip is inserted into the bracket according to the conventional technique and baked. The invention pre-heats the model strip and the bracket, enables the epoxy resin glue to be under the condition of higher bulk temperature, allows the fluidity of epoxy resin to be similar to water, exhausts the air in the bracket bowl cup, and efficiently prevents the generation of bubbles during the gluing process; and the operation is simple and rapid; and the gluing amount is easy to control than gluing by a machine.
Description
technical field [0001] The invention relates to an LED adhesive process suitable for LED packaging, and belongs to the technical field of optoelectronic applications. Background technique [0002] As a new type of industry, the semiconductor industry has formed a relatively mature process route from upstream chip production to midstream LED packaging, and the final application. LED packaging is to fix the LED chip into the cup of the bracket, which requires the use of mold strips , There are several mold holes distributed on the mold bar. But its extension and development are far from enough. During the encapsulation process, epoxy resin is prone to produce air bubbles, especially when the bracket is inserted upside down into the mold strip, because the bowl is empty, it is easy to produce air bubbles, which will affect the performance of the LED. Glow and look. Therefore, the bracket needs to be glued before packaging. The existing viscose process is generally operated b...
Claims
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IPC IPC(8): H01L33/00
Inventor 庄智勇
Owner Shandong Huaguang Optoelectronics Co. Ltd.