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Interconnection of electronic devices with raised leads

A technology of electronic devices and electronic components, which is applied in the field of electronics and can solve problems such as easy separation

Inactive Publication Date: 2011-04-13
ELES SEMICON EQUIP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

On the other hand, in EP-A-0870325 a very high precision is required to obtain the correct size of the round head below the tip; indeed, the corresponding manufacturing process must be perfectly controlled in order to guarantee that the tip is held by the multilayer board (in before they are connected to the wafer), but at the same time they are easy to separate when the wires have to be extended

Method used

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  • Interconnection of electronic devices with raised leads
  • Interconnection of electronic devices with raised leads
  • Interconnection of electronic devices with raised leads

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Embodiment Construction

[0043] Referring now to Figures 1a-1g, various stages of a process of fabricating an interconnection element according to various embodiments of the present invention are illustrated.

[0044] Considering FIG. 1a in particular, the fabrication process starts with a single crystal silicon wafer 105 . As described in detail below, the wafer 105 implements a lower substrate for interconnecting wires; more specifically, the wires are formed on the front (main) surface 110 of the lower substrate 105 and then lifted.

[0045] To this end, a photo-resist mask 115 is formed on top of the front surface 110 . The photoresist mask 115 is obtained by depositing a layer of photoresist material and then patterning it by a photo-lithographic process; in this way, windows are opened in the photoresist material for The desired wires expose corresponding contact areas 117 of the front surface 110 . The contact area 117 can have any shape and size (depending on the wire to be formed). For exa...

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Abstract

A process of manufacturing an interconnection element (160; 160') for contacting electronic devices is proposed. The process starts with the step of forming a plurality of leads (130) on a main surface (110) of a first substrate (105); each lead has a first end (130a) and a second end (130b). The second end of each lead is coupled with a second substrate (140). The second substrate and the first substrate are then spaced apart, so as to extend the leads (130') between the first substrate and the second substrate. The process also includes the step of treating the main surface before forming the leads to control an adhesion of the leads on the main surface.

Description

technical field [0001] The present invention generally relates to the field of electronics. More specifically, the present invention relates to the interconnection of electronic devices. Background technique [0002] Electronic devices often have to be interconnected with each other in order to accomplish many tasks. An example is a multi-chip module (Mcm), in which multiple circuits integrated in corresponding chips of semiconductor material are packaged in a single electronic assembly. Another example is probe cards, which are used to contact integrated circuits at the wafer level for their testing. [0003] Several solutions have been proposed to achieve the desired effect. In particular, a specific technique known in the prior art is based on the raising of flexible wires. [0004] For example, EP-A-0352020 discloses a system for interconnecting a plurality of chips by means of a semiconductor carrier. To this end, the conductive pads of each chip are connected to c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48
CPCH01L21/6835G01R3/00G01R1/07342H01L2924/01078H01L24/72H01L21/4853H01L2924/01079H01L2924/3025G01R1/06711H01L2924/01087H01L2924/1461H01L2924/12032H01L2924/12042H01L2924/14H01L2924/00
Inventor 马尔科·巴卢坎蒂
Owner ELES SEMICON EQUIP