Sprayer capable of preventing abrasive on grinder table from aggregating and use method thereof

Abstract

The invention provides a water spray device for preventing abrasives on a grinder stand from gathering and an application method, and can effectively solve the problem of grinded wafer defect caused by the gather of abrasives on a machine head of the grinder stand. The water spray device comprises two water spray components, each water spray component comprises a plurality of water spray holes, abase, a bracket, a clamping hole and a water pipe; the plurality of the water spray holes are positioned on the bracket, the clamping hole is positioned at the bottom of the base, one end of the bracket is fixed on the base, the other end of the bracket is fixed on the grinder stand, the water pipe has three ends, wherein two ends are connected the water inlet holes of the two water spray components respectively, while the other end is connected with an interface of a moisturizing device of the grinder stand. The water spray device cleans and moisturizes two side edges and a bottom edge of the machine head in a wafer loading area. Gathered substances of the abrasive left on the side edges and the bottom edge of the machine head can be removed by the water spray device; and at the same time, the machine head keeps wet to prevent the abrasive anew splashing to the machine head of the grinder stand from gathering.

Description

technical field [0001] The invention relates to a chemical mechanical polishing process in a semiconductor process, in particular to a water spray device for preventing aggregation of abrasive materials on a grinding machine table and a use method thereof in the grinding process of mechanical polishing. Background technique [0002] In the semiconductor process, chemical mechanical polishing is a very important process. Nowadays, the chemical mechanical polishing process is mainly realized by grinding machines. The grinder table usually includes a moistening device with several interfaces, the grinder table control unit. The moisturizing device interface of the grinding machine is connected to the deionized water source, and its opening and closing are controlled by the grinding machine control unit. [0003] The entire machine will be divided into several grinding areas and a wafer loading and unloading area, and each grinding area and wafer loading and unloading area wil...

AI Technical Summary

Problems solved by technology

[0008] The invention provides a water spray device for preventing the polymerization of abrasives on the grinding machine table and its use method, which can solve the defect problem of grinding wafers caused by the polymerization of abrasives on the mechanical head on the grinding machine table

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