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Wafer grinding fluid and preparation method thereof

A technology of grinding liquid and wafer, applied in chemical instruments and methods, other chemical processes, petroleum industry, etc., can solve problems such as poor anti-rust performance, environmental pollution, troublesome cleaning, etc., to increase anti-rust ability and improve grinding quality , the effect of reducing damage

Active Publication Date: 2020-12-15
威科赛乐微电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Oil agent mainly has good viscosity, lubrication and anti-rust performance, but it is troublesome to clean and pollutes the environment
In the process of grinding wafers, water-based abrasives are preferred, but the disadvantage of water-based abrasives is that they have poor anti-rust performance.

Method used

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  • Wafer grinding fluid and preparation method thereof
  • Wafer grinding fluid and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The grinding oil of this embodiment includes the following raw materials in mass percentage: 8% sodium azelate amide, 8% sodium laurate, 10% monoethanolamine, 15% triethanolamine, and 59% water.

[0033] The grinding liquid includes the following raw materials in mass percentage: 30% grinding powder, 1% grinding oil, 1% dispersant, 1% surfactant, 2% chelating agent, and 65% deionized water.

[0034] Grinding Oil Preparation

[0035] According to the proportion, each raw material was weighed respectively, firstly, sodium azelaic acid amide was added into water, and continued to stir until it was completely dissolved, then sodium laurate was added, stirred to dissolve, then monoethanolamine and triethanolamine were added and stirred evenly to obtain grinding oil.

[0036] Grinding liquid preparation

[0037] According to the proportion, weigh the dispersing agent sodium hexametaphosphate, the surfactant polyethylene glycol, and the chelating agent edetate disodium, stir ...

Embodiment 2

[0039] The grinding oil of this embodiment includes the following raw materials in mass percentages: 10% sodium azelaic acid amide, 10% sodium laurate, 10% monoethanolamine, 25% triethanolamine, and 45% water.

[0040] Grinding fluid includes the following mass percentage raw materials: 30% grinding powder, 1.5% grinding oil, 1% dispersant, 1.5% surfactant, 2% chelating agent, 64% deionized water

[0041] The preparation of the grinding oil and the preparation method of the grinding liquid are the same as in Example 1.

Embodiment 3

[0043] The grinding oil of this embodiment includes the following raw materials in mass percentages: 8% sodium azelate amide, 8% sodium laurate, 10% monoethanolamine, 25% triethanolamine, and 49% water.

[0044] The grinding solution includes the following raw materials in mass percentage: 30% grinding powder, 1.5% grinding oil, 1.5% dispersant, 1.5% surfactant, 2% chelating agent, and 63.5% deionized water.

[0045] The preparation of the grinding oil and the preparation method of the grinding liquid are the same as in Example 1.

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Abstract

The invention discloses a wafer grinding fluid and a preparation method thereof, and relates to the technical field of semiconductor materials. The wafer grinding fluid is prepared from the followingraw materials: grinding powder, grinding oil, a dispersing agent, a surfactant, a chelating agent and deionized water, and the preparation method comprises the following steps: respectively weighing the dispersing agent, the grinding oil, the surfactant and the chelating agent, uniformly stirring and mixing to obtain a mixed solution, adding the mixed solution into the grinding powder, continuously stirring and dispersing, and pouring into the deionized water, continuously stirring and mixing for 30-60 minutes, adding the grinding oil, continuously stirring and uniformly mixing, and filteringtwice by using a high-density filter screen to obtain a grinding liquid. According to the wafer grinding fluid and the preparation method thereof, through the combined action of all the components, the antirust capacity of a grinding disc is improved, and the grinding efficiency and the grinding quality can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor materials, in particular to a wafer polishing liquid and a preparation method thereof. Background technique [0002] In the whole semiconductor material processing, the grinding process is a very important process. The main function of grinding is to use the abrasive particles coated or pressed on the grinding tool to finish the machined surface (such as cutting) through the relative movement of the grinding tool and the workpiece under a certain pressure. Grinding can be used to process various metal and non-metal materials. The processed surface shapes include plane, inner and outer cylindrical and conical surfaces, convex and concave spherical surfaces, threads, tooth surfaces and other profiles. [0003] The main body of the grinding liquid is divided into two types: oil agent and water agent. The oil agent grinding liquid is mainly composed of aviation gasoline, kerosene, variable pres...

Claims

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Application Information

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IPC IPC(8): C09K3/14C10M173/02C10N30/12C10N30/06
CPCC09K3/1463C10M173/02C10M2215/08C10M2207/127C10M2215/042C10M2201/085C10M2209/104C10M2215/04C10M2201/062
Inventor 毕洪伟周一刘留苏小平王春平
Owner 威科赛乐微电子股份有限公司
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