A kind of wafer polishing liquid and preparation method thereof

Abstract

The invention discloses a wafer grinding liquid and a preparation method thereof, and relates to the technical field of semiconductor materials. A kind of wafer grinding liquid of the present invention, raw material comprises grinding powder, grinding oil, dispersant, surfactant, chelating agent, deionized water, and its preparation method is, respectively weighs dispersing agent, grinding oil, surfactant, chelating Stir and mix the mixture evenly to obtain a mixed solution, add the mixed solution to the grinding powder, continue stirring to disperse, pour it into deionized water, continue stirring and mixing for 30-60 minutes, add grinding oil, continue to stir and mix evenly, use a high-density filter Filter twice to obtain grinding liquid. The invention discloses a wafer grinding liquid and a preparation method thereof. Through the joint action of various components, the antirust ability of the grinding disc is increased, and the grinding efficiency and grinding quality can be improved.

Description

A kind of wafer grinding liquid and preparation method thereof technical field [0001] The present invention relates to the technical field of semiconductor materials, in particular to a wafer lapping liquid and a preparation method thereof. Background technique [0002] In the entire semiconductor material processing, the grinding process is a very important process. The main work of grinding The use is to use the abrasive particles coated or pressed on the grinding tool, through the relative movement of the grinding tool and the workpiece under a certain pressure. Finishing (such as cutting) performed on the work surface. Grinding can be used to process a variety of metal and non-metallic materials, the processing of the table Surface shapes include plane, inner and outer cylindrical and conical surfaces, convex and concave spherical surfaces, threads, tooth surfaces and other profiles. Grinding fluid main body is divided into two kinds of oil agent and water agent,...

AI Technical Summary

Problems solved by technology

Oil agent mainly has good viscosity, lubrication and anti-rust performance, but it is troublesome to clean and pollutes the environment

In the process of grinding wafers, water-based abrasives are preferred, but the disadvantage of water-based abrasives is that they have poor anti-rust performance.

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