Display device with flip-chip structure

Abstract

The invention discloses a display device with a flip-chip structure, the display device at least comprises a first substrate and at least one integrated circuit chip which is arranged on the first substrate, wherein, a plurality of connecting bumps are arranged on one surface of the integrated circuit chip, the connecting bumps are connected between the integrated circuit chip and the first substrate; and the display device also comprises at least one Dummy Bump which is clamped between the integrated circuit chip and the first substrate for balancing the distribution of the connecting bumps on the surface of the integrated circuit chip.

Description

technical field [0001] The present invention relates to a display device, and in particular to a display device with a flip chip structure (Flip Chip). Background technique [0002] In a display device with a flip-chip structure, a plurality of welding bumps (Bumps) are provided on the lower surface of an integrated circuit (IC) chip for electrical bonding between the IC chip and a display panel of the display device. [0003] Please refer to FIG. 1 , which is a schematic partial cross-sectional view of a conventional display device with a flip-chip structure. When bonding the integrated circuit (IC) chip 108 on the display panel 102 of the display device 100, usually a layer of anisotropic conductive film (Anisotropic Conductive Film) 104 is first coated on the display panel 102, and then the integrated circuit chip 108 is placed and pressed. on the anisotropic conductive adhesive 104, so that the integrated circuit chip 108 is glued on the display panel 102 by using the a...

AI Technical Summary

Problems solved by technology

[0004] However, the design of the connection bumps on the general integrated circuit chip often only considers the functionality, while ignoring the uniform symmetry of the structure, so the positions of the connection bumps on the integrated circuit chip are mostly unevenly distributed.

In the case of uneven distribution of connection bumps, uneven pressure will occur during the bonding process, causing the integrated circuit chip to see-saw, which will lead to connection bumps and anisotropy. Poor pressing of conductive particles in conductive adhesive

Too much or too little pressing force between the connection bump and the conductive particles in the anisotropic conductive adhesive will cause poor signal conduction, which will lead to a decrease in the bonding yield of the flip chip process

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