Heat radiation structure and LED lamp
A light-emitting diode lamp and a technology of light-emitting diodes, which are applied to semiconductor devices of light-emitting elements, light sources, point light sources, etc., can solve the problems of increasing the overall weight and manufacturing cost of light-emitting diode lights, increasing the volume of metal radiators, and poor heat dissipation effects and other issues, to achieve light weight, low manufacturing cost, and good heat dissipation effect
Inactive Publication Date: 2009-04-29
埃迪科技(苏州)有限公司
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Problems solved by technology
For this type of heat dissipation, in order to increase the heat dissipation effect, it is necessary to increase the volume of the metal heat sink, resulting in an increase in the overall weight and manufacturing cost of the LED lamp
According to this type of heat-dissipating LED lamp, when the LED lamp is composed of vertically structured LEDs, it is necessary to cut off the remaining pins of the LEDs welded on the circuit board (usually using a printed circuit board) to prevent the light from emitting light. The heat dissipation of the diode can only be carried out through the wiring on the circuit board, heat dissipation glue and metal heat sink, which leads to the problem of increasing the process and making the heat dissipation effect not good
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[0011] figure 1 It is a cross-sectional view showing the structural principle of the heat dissipation structure according to an embodiment of the present invention. see figure 1 , The heat dissipation structure of the present invention includes: a substrate 2 provided with a heating element 1 , and a heat sink 3 connected to the substrate 2 for dissipating heat from the heating element 1 . Radiator 3 comprises: comprise side wall 41, the top wall 42 that joins with side wall 41 and the heat dissipation cover 4 of cover mouth 43 opposite with top wall 42; The heat dissipation glue 5 in the heat dissipation cover surrounded by the wall 42 and the substrate 2 .
[0012] The heating element 1 is a component that generates a large amount of heat energy during operation. Examples of heating elements may be, for example, light emitting diodes, high-power electronic components, and the like. The role of the substrate 2 is to encapsulate the heat dissipation glue 5 in the heat diss...
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The invention discloses a radiating structure and an LED lamp comprising the radiating structure. The LED lamp is characterized in that the radiating structure comprises a substrate of a heating element, and a radiator which is connected with the substrate and is used for radiating of the heating element. The radiator comprises a side wall, an upper wall, a radiating cover, radiating glue and residual space, wherein the side wall is connected with the upper wall; the radiating cover covers on a cover mouth opposite to the upper wall; the substrate is arranged at the cover mouth; the radiating glue is filled in the radiating cover enclosed by the side wall, the upper wall and the substrate; and the residual space is formed in the radiating cover after the assembly of the radiating structure filled with the radiating glue. The radiating structure and the LED lamp have the advantages of light weight and low cost.
Description
technical field [0001] The invention relates to a heat dissipation structure and a light-emitting diode lamp with the heat dissipation structure. Background technique [0002] In the existing LED lamps, the components or circuit boards with LEDs are usually bonded to the metal through a thin layer of heat dissipation glue (it can be a commercially available commodity, which has good thermal conductivity and non-conductivity). The heat generated by the light-emitting diodes is dissipated on the heat sink formed. For this type of heat dissipation, in order to increase the heat dissipation effect, it is necessary to increase the volume of the metal heat sink, resulting in an increase in the overall weight and manufacturing cost of the LED lamp. According to this type of heat-dissipating LED lamp, when the LED lamp is composed of vertically structured LEDs, it is necessary to cut off the remaining pins of the LEDs welded on the circuit board (usually using a printed circuit boa...
Claims
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IPC IPC(8): F21V29/00H01L23/367F21Y101/02F21V29/503F21Y115/10
CPCH01L2924/0002
Inventor 俞志龙
Owner 埃迪科技(苏州)有限公司