Heat radiating device for LED and manufacturing method therefor

Abstract

An LED heat sink comprises a substrate and a plurality of LEDs which are pressed at the bottom of the substrate. At least one heat tube structure is formed in the substrate and integrated with the substrate as a whole; each heat tube structure comprises a channel which is arranged in a base, a capillary structure and working fluid are arranged inside the channel, and the two ends of the channel are respectively sealed. The invention further discloses a manufacturing method of the LED heat sink. The bottom surface of the substrate has relatively flat forming and large surface area, and the LEDs can keep close contact with the bottom surface, thus ensuring the effectiveness and the evenness of heat transfer between the LEDs and the substrate and causing the service life of various LEDs to be kept basically the same; meanwhile, the substrate is provided with the heat tube structure which can ensure that the heat sink has higher heat conduction efficiency.

Description

technical field [0001] The invention relates to a light-emitting diode cooling device, in particular to a cooling device with a heat pipe and a manufacturing method thereof. Background technique [0002] Light Emitting Diode (LED) lamps are being widely used due to their advantages of energy saving and environmental protection. However, high-brightness and high-power LEDs generate a lot of heat. As a result, the luminous efficiency is significantly reduced, and even the components are damaged. The industry usually installs a radiator under the LED lamp to dissipate heat, and what is more, a heat pipe is embedded at the bottom of the radiator, and then the LED is attached to the The surface of the heat pipe is expected to improve the heat dissipation efficiency through the high thermal conductivity of the heat pipe. However, the surface of the heat pipe is often not smooth enough and the surface area is small, resulting in a part of the light-emitting diodes not in close con...

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Problems solved by technology

[0002] Light Emitting Diode (LED) lamps are being widely used due to their advantages of energy saving and environmental protection. However, high-brightness and high-power LEDs generate a lot of heat. As a result, the luminous efficiency is significantly reduced, and even the components are damaged. The industry usually installs a radiator under the LED lamp to dissipate heat, and what is more, a heat pipe is embedded at the bottom of the radiator, and then the LED is attached to the The surface of the heat pipe is expected to improve the heat dissipation efficiency through the high thermal conductivity of the heat pipe

However, the surface of the heat pipe is often not smooth enough and the surface area is small, resulting in a part of the light-emitting diodes not in close contact with the surface of the heat pipe, forming a gap between the light-emitting diodes and the surface of the heat pipe to affect heat conduction, thus causing the temperature of the local light-emitting diodes to be too high or even damaged. LEDs in the same luminaire have different lifetimes, which affect the performance of the luminaire

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