Automatic wire-distributing and wire-connecting system apparatus for packaging autolisp

Abstract

The invention discloses an AutoLisp encapsulation automatic wiring and line connecting system and device which can realize automatic wiring and line connecting of integrated circuit encapsulation, greatly enhance the efficiency and lower the line connecting error rate. Particularly in the line connecting of a high line position in the integrated circuit encapsulation, the AutoLisp encapsulation automatic wiring and line connecting system and device has more dramatically efficiency. Compared with the traditional manual wiring, the invention greatly enhances the wiring efficiency and realizes the automation of the wiring production technology. The AutoLisp encapsulation automatic wiring and line connecting system and device runs under the environment after an AutoCAD R14 version or a higher version of Windows 95 / 98 / ME / XP / 2003 or a higher operating system runs, and is worked out by AutoLisp language. The AutoLisp encapsulation automatic wiring and line connecting system and device is characterized by comprising a lead frame coordinate data extraction device Getp1, a chip diagram pressure point extraction device Getpp, an automatic line connecting device Bond and an automatic erasing device Delbd, an extracted lead frame coordinate point combines with an external given chip coordinate point or chip diagram pressure point coordinate point, and automatic line connecting is carried out through the automatic line connecting device Bond. When the line connecting cannot satisfy the requirements, the automatic erasing device Delbd erases all the diagrams generated by the automatic line connecting once, and then the automatic line connecting is executed to carry out regulation until the requirements are satisfied.

Description

(1) Technical field [0001] The invention relates to the field of integrated circuit packaging, especially the combination of CAD secondary development software technology and the wiring technology in the field of integrated circuit packaging, specifically an AutoLisp packaging automatic wiring connection system device. (2) Background technology [0002] 1. With the entry of high-line products, the accuracy of packaging and wiring is challenged, and new issues are also raised for efficiency. The traditional manual drawing method in CAD can no longer adapt to high-level wiring. Accuracy and quick response requirements; [0003] 2. Using the method of pressing dots and drawing lines can slightly improve some efficiency, but it is still far from the actual requirements. It is easy to make wiring errors during the evaluation of high-line package products, and it takes too long to complete a package wiring diagram. (3) Contents of the invention [0004] In view of the above pro...

AI Technical Summary

Problems solved by technology

[0002] 1. With the entry of high-line products, the accuracy of packaging and wiring is challenged, and new issues are also raised for efficiency. The traditional manual drawing method in CAD can no longer adapt to high-level wiring. Accuracy and quick response requirements;

[0003] 2. By using the method of pressing dots and drawing lines, some efficiency can be slightly improved, but it is still far from the actual requirements. It is easy to make wiring errors in the evaluation of high-line packaging products, and it takes too long to complete a package wiring diagram.

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