Method for processing crystal covering thin film

Abstract

The invention relates to a method for pressing chip on films, which is to choose pressing parameter groups according to the width of the chip on films, so as to thermally press the chip on films on substrates. The method comprises the steps of measuring the first width of a first chip on film, and comparing the first width with a first reference range to obtain a first deviation value; choosing acorresponding first pressing parameter group according to the first deviation value, and thermally pressing the first clip on film to a first substrate; measuring a second width of the first clip on film after thermally pressing, and comparing the second width with a second reference range to obtain a second deviation value; measuring the third width of the second clip on film, and comparing the third width with the first reference range to obtain a third deviation value; and choosing a corresponding second pressing parameter group according to the second deviation value and the third deviation value to thermally press the second clip on film on the second substrate. The method effectively reduces the disqualification rate of the products caused by chip on film, thereby reducing the humanresources for adjusting.

Description

technical field [0001] The present invention relates to the related technical field of the lamination method of the chip-on-chip object, in particular, a method of lamination of the chip-on-chip film. Background technique [0002] Traditional manufacturing of glass substrate assembly modules includes chip on glass (COG), chip on film (COF), and outer lead bonding connected to the glass substrate; OLB) and other methods. The production process of film-on-chip bonding includes a pre-pressing program, a pressing program and an inspection program. In this process, a crimping equipment (hereinafter referred to as COF crimping machine) is used to pre-press a chip-on-chip film. The crimping equipment can perform alignment first, and then the COF crimping machine will carry out the process of pressing the COF film so that the COF film can be fixed on the glass substrate before the subsequent inspection process. [0003] The working principle of the COF crimping machine is to expos...

AI Technical Summary

Problems solved by technology

[0004] However, the above-mentioned traditional inspection procedures are only adjusted according to the offset value of the COF, but cannot be adjusted according to the width of the COF before pre-pressing or the degree of expansion and extension of the COF due to high-temperature bonding. Adjustment, in this way, a lot of manpower is required to adjust to reduce the product failure rate caused by bad displacement

Images