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Method for preparing aluminium nitride substrate

An aluminum nitride substrate and aluminum substrate technology, applied in the field of surface treatment of metal materials, can solve the problems of complicated processing steps, long processing time, energy consumption, etc., and achieve the effects of simplified procedures, high adhesion strength, and easy deformation.

Inactive Publication Date: 2009-06-24
COSMOS VACUUM TECH CORP
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0006] However, the above methods are sintered at a high temperature above 1700 degrees Celsius, and the processing steps are complicated, and there is a disadvantage of long processing time, so it consumes a lot of energy; at the same time, such high temperature sintering is also prone to thermal deformation.

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  • Method for preparing aluminium nitride substrate
  • Method for preparing aluminium nitride substrate
  • Method for preparing aluminium nitride substrate

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Embodiment Construction

[0068] The method for preparing an aluminum nitride substrate of the present invention includes the following steps: a) First, a plurality of aluminum nitride (AlN) particles are uniformly coated on the surface of an aluminum substrate; b) The aluminum substrate is sent into a vacuum furnace, Then pass ammonia gas (NH 3 ); c) heating the aluminum substrate in the vacuum furnace to obtain an aluminum nitride substrate from the vacuum furnace; the setting conditions of the vacuum furnace are as follows: the furnace temperature range is 400 degrees Celsius to 580 degrees Celsius degree.

[0069] In order to describe the features and effects of the present invention in detail, the following preferred embodiments are illustrated in conjunction with the accompanying drawings, in which:

[0070] See Figure 1 to Figure 5 , Is a method for preparing an aluminum nitride substrate provided by the first preferred embodiment of the present invention, which includes the following steps:

[007...

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Abstract

The invention relates to a method for preparing an aluminum nitride substrate. The method comprises the following steps: a) most aluminum nitride (AlN) particles are evenly covered on the surface of an aluminum substrate first; b) the aluminum substrate is sent to a vacuum furnace; ammonia gas (NH3) is conducted to the vacuum furnace; and c) the aluminum substrate in the vacuum furnace is heated; therefore, the aluminum nitride substrate is obtained in the vacuum furnace. The vacuum furnace has the following set condition: the temperature range of the furnace is between 400 and 580DEG C.

Description

Technical field [0001] The invention relates to the surface treatment technology of metal materials, and particularly relates to a method for preparing an aluminum nitride substrate. Background technique [0002] Known methods for preparing aluminum nitride substrates can be mainly divided into the following two types: [0003] 1. The co-fire method (co-fire) is to apply a metal paste mixed with high melting point metals on the surface of an aluminum substrate, and then sinter it at a high temperature above 1700 degrees Celsius to form a surface of the aluminum substrate. The aluminum nitride layer achieves the purpose of preparing the aluminum nitride substrate; the characteristic of the co-firing method is that the aluminum nitride layer can be coated on the surface of the aluminum substrate with higher bonding strength. However, since this method is continuous high temperature sintering for a long time, the peripheral portion of the aluminum substrate is likely to shrink and b...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F7/04
Inventor 黄续镡周钟霖
Owner COSMOS VACUUM TECH CORP