Cleaning agent for semiconductor industry

An industrial and cleaning agent technology, applied in the field of cleaning agents, can solve the problems of high pressure resistance, high insulation, non-combustion, non-corrosiveness and environmental protection, and achieves the effect of easy disposal and discharge, meeting the requirements of environmental protection three wastes discharge, and safe and reliable use.

Active Publication Date: 2011-08-17
JIANGSU HAIXUN IND GROUP SHARE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] According to the cleaning requirements, some cleaning agents have appeared on the market, but they have shortcomings in terms of high pressure resistance, high insulation, non-combustibility, non-corrosiveness, and environmental protection, and most of them are ozone-depleting substances (ODS) products , with the improvement of the country's environmental protection requirements, it is facing the situation of elimination

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] In the present embodiment, the percentage by weight of each component of cleaning agent for semiconductor industry is as follows:

[0036] components

[0037] Preparation method: Prepare each component according to the above ratio, dissolve the above components in deionized water at room temperature, stir and mix evenly, and then become the finished cleaning agent of the present invention.

Embodiment 2

[0039] In the present embodiment, the percentage by weight of each component of cleaning agent for semiconductor industry is as follows:

[0040] components

[0041] Preparation method: Prepare each component according to the above ratio, dissolve the above components in deionized water at room temperature, stir and mix evenly, and then become the finished cleaning agent of the present invention.

Embodiment 3

[0043] In the present embodiment, the percentage by weight of each component of cleaning agent for semiconductor industry is as follows:

[0044] components

[0045] Preparation method: Prepare each component according to the above ratio, dissolve the above components in deionized water at room temperature, stir and mix evenly, and then become the finished cleaning agent of the present invention.

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PUM

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Abstract

The invention relates to a cleansing agent for semiconductor industry. The cleansing agent comprises the following compositions according to the weight percentage: 0.2-1 portion of a main agent, 5-15 portions of a surface active agent, 3-8 portions of an antistatic agent, 3-5 portions of a synergistic agent, 3-8 portions of an organic solvent, and the rest being de-ionized water. The cleansing agent has the technical effects as follows: (1) dosage of the solvent and the surface active agent is reasonably arranged in the cleansing agent, so that surface tension of the cleansing agent is greatly reduced, while the cleansing agent has the advantages of good water solubility and strong permeability; (2) the chemical reagents adopted in the cleansing agent does not pollute environment, can notbe easily combusted, and belongs to an ozone-friendly substance, and the waste liquid after cleansing is easy to treat and discharge, thereby meeting the requirements of environmental protection and the 'three wastes' discharge; and (3) the preparation process is simple, the operation is convenient, and the application is safe and reliable.

Description

technical field [0001] The invention relates to a cleaning agent, in particular to a water-based cleaning agent for the semiconductor industry. Background technique [0002] Cleaning technology is extremely important to the semiconductor industry. It can be said that without effective cleaning technology, there would be no semiconductor industry today. Today's semiconductor industry has developed worldwide, but the cleaning technology of the semiconductor industry still uses the traditional cleaning technology of more than 40 years. Traditional cleaning technology mainly uses chemical reagents such as acid, alkali, hydrogen peroxide, toluene, trichlorethylene, and freon, which are not only expensive, but also toxic and corrosive, endangering the safety and health of operators, and polluting the environment. In particular, ODS substances such as freon seriously damage the ozone layer at the high altitude of the earth and endanger the human ecological environment. They are su...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C11D1/66C11D3/43
Inventor 仲跻和
Owner JIANGSU HAIXUN IND GROUP SHARE
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