Isolated transformer device, printed circuit board and manufacturing process thereof

Abstract

The invention provides an insulating transformer device, a printed circuit board and a manufacturing method thereof. The device consists of an insulating transformer part and an interface part, wherein, the insulating transformer part comprises a plurality of insulating transformers, a plurality of resistors and a first capacitor; the insulating transformers correspond to a plurality of network ports with hundreds of megabytes, one end of each of the resistors is connected with a coil CT of the insulating transformer, and the other end of each of the resistors is connected with a PGND network via the first capacitor; and the interface part comprises a plurality of RJ45 interfaces, a plurality of banks of resistors and a second capacitor, wherein, the RJ45 interfaces correspond to the insulating transformers, one end of each of the banks of resistors is connected with pins 4 and 5, as well as 7 and 8 of the RJ45 interfaces respectively, the other end of each of the arrays of resistors is connected with the PGND network via the second capacitor, and each bank of resistors consists of two resistors. The invention can upgrade the lightning protection of the network ports with hundreds of megabytes and reduce the lightening damage to the network equipment.

Description

technical field [0001] The invention relates to the communication field, in particular to a 100M network port isolation transformer device for optimizing the lightning protection performance of the 100M network port, a printed circuit board, and a method for manufacturing the printed circuit board. Background technique [0002] With the promotion of the application of network equipment, the phenomenon of damage to network equipment caused by lightning occurs frequently, and the direct economic losses caused are becoming more and more serious. The research on improving the lightning protection capability of network ports has become more and more valuable. [0003] In the process of realizing the present invention, the inventor finds that there are following problems in the prior art: [0004] On some network devices with high-density ports, due to the dense ports, the spacing between devices in PCB (Print Circuit Board: printed circuit board) design is very small, and the wir...

AI Technical Summary

Problems solved by technology

If the surface mount device is placed under the in-line device, the surface mount device needs to be protected when soldering the in-line device, which will affect the placement efficiency

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