Glue spreading device

A glue coating device and cover technology, which is applied to the device and coating of the surface coating liquid, can solve the problem of easy falling off of photo-induced anti-corrosion agent, achieve the effect of simple and ingenious structure, ensure uniformity, and protect the environment

Inactive Publication Date: 2009-07-29
SHENYANG KINGSEMI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the above-mentioned problems, the present invention provides a new type of glue coating device in packaging, which solves the problems that the coated high-viscosity photocorrosion agent is easy to fall off, etc.

Method used

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  • Glue spreading device
  • Glue spreading device

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Embodiment Construction

[0016] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0017] like Figure 1-Figure 2 As shown, the gluing device of the present invention is provided with a cover drive rod 1, an external cover 2, an internal sealing rotary cover 3, a rotary bearing 4, a coupling shaft 5, a sealing ring 6, a rotary cavity 7, and an external collection cup for exhaust and liquid collection. 8. Open and close cover driving cylinder 9, wafer chuck 10, rotating motor 11, colloid discharge port 12, loading wafer bracket 13, wafer bracket driving cylinder 14. The outer cover 2 and the inner sealing rotating cover 3 are connected through the coupling shaft 5 to form the upper cover of the glue application device. The outer cover 2 is located on the outside, the inner sealing rotating cover 3 is located on the inner side, and the connecting shaft 5 and the inner sealing rotating cover 3 are matched through the rotating bearing 4 ...

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Abstract

The invention relates to a glue coating device for semiconductor backend encapsulation, namely a device for coating high-consistency photoresist on the surface of a wafer. A rotating cavity is formed in a gas-discharging and liquid-gathering outer gathering cup of the glue coating device; an upper opening of the gas-discharging and liquid-gathering outer gathering cup is provided with a sealing ring; the gas-discharging and liquid-gathering outer gathering cup is provided with a colloid discharge outlet; a upper cover of the glue coating device has a matched structure corresponding to the gas-discharging and liquid-gathering outer gathering cup through rotation; a wafer loading bracket driven to lift by a wafer bracket driving cylinder is provided with a wafer sucker; the wafer sucker is arranged in the rotating cavity of the gas-discharging and liquid-gathering outer gathering cup; and a rotating machine driving the wafer loading bracket to rotate is provided with a vacuum line communicated with the wafer sucker inside. The glue coating device can solve the problem of easy falling off of the coated high-consistency photoresist and the like, and is not only suitable for the common photoresist for backend encapsulation but also suitable for higher-consistency photoresist.

Description

Technical field: [0001] The invention relates to a glue coating device in the subsequent packaging of semiconductors, that is, a coating device for applying a high-viscosity photocorrosion resist on the surface of a wafer. Background technique: [0002] At present, there are a lot of equipment used in the subsequent packaging process of semiconductor equipment, but for some high-viscosity photoresists, ordinary glue coating devices have many defects, because some high-viscosity photoresist The corrosive agent is composed of several organic solvents mixed and stirred. Not only is the viscosity high, but also the internal organic solvent is very volatile, which often causes the coating thickness on the surface of the product to fail to meet the requirements, or the uniformity of the coating is not good. These high-viscosity photocorrosion resists are very sensitive to temperature and humidity. If they are not properly controlled, their viscosity will change and fail to meet th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C5/02B05C11/10B05C13/02
Inventor 元金
Owner SHENYANG KINGSEMI CO LTD
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