Method for preparing soft hard combined board

A technology of a rigid-flex board and a manufacturing method, which is applied in the fields of printed circuit manufacturing, multi-layer circuit manufacturing, and processing of insulating substrates/layers, and can solve problems affecting the appearance and performance of a rigid-flex board and the formation of burrs on the edge of a flexible area , The forming accuracy of the flexible zone is not high, etc.

Active Publication Date: 2009-07-29
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Claims
  • Application Information

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Problems solved by technology

However, the manufacturing method of rigid-flex boards in the prior art has the following disadvantages: First, due to the different properties of the flexible zone and the rigid zone, the hardness of the flexible zone is much smaller than that of the rigid zone, so the same tool, that is, a milling cutter, is used to form a soft plate. When the board is rigidly bonded, it is easy to form burrs on the edge of the flexible area, which may even cause deformation of the flexibl...

Method used

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  • Method for preparing soft hard combined board
  • Method for preparing soft hard combined board
  • Method for preparing soft hard combined board

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Embodiment Construction

[0018] The manufacturing method of the rigid-flex board provided by the technical solution will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0019] The manufacturing method of the rigid-flex board provided by the embodiment of the technical solution includes the following steps:

[0020] Step one, see figure 1 , at least one flexible substrate 10 and at least one rigid substrate 20 are provided.

[0021] In this embodiment, only one flexible substrate 10 and two rigid substrates 20 are provided as an example to illustrate the method of making a rigid-flex board

[0022] The flexible substrate 10 is double-sided, which includes a first conductive layer 101 , a second conductive layer 102 and a first insulating layer 103 connected between the first conductive layer 101 and the second conductive layer 102 . In this embodiment, both the first conductive layer 101 and the second conductive layer 102 have been formed with co...

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Abstract

The invention provides a method for manufacturing soft-hard combined plate, which comprises the following steps: providing at least one soft substrate and at least one hard substrate, where both the soft substrate and the hard substrate comprise a first region for forming, a second region for forming and a waste material region; cutting the boundary between the second region for forming and the waste material region on the soft substrate by a first tool; matching the soft substrate and the hard substrate, and pressing the soft substrate and the hard substrate; removing the second region for forming of the hard substrate; cutting the boundary between the first region for forming and the waste material region by a second tool to cause the waste material region to fall off, thereby obtaining the soft-hard combined plate. The soft-hard combined plate manufacturing method with the above technical solution achieves better forming effect and higher forming precision.

Description

technical field [0001] The invention relates to circuit board technology, in particular to a method for manufacturing a rigid-flex board. Background technique [0002] Rigid-Flexible Printed Circuit Board (R-F PCB) refers to a printed circuit board that contains one or more rigid areas and one or more flexible areas, which is also a rigid board (Rigid Printed Circuit Board, RPCB , rigid circuit board) durability and soft board (Flexible Printed Circuit Board, FPCB, flexible circuit board) flexibility, which has the characteristics of thin, compact and resistant to harsh application environments, especially suitable for portable electronic products, medical electronic products, Applications in precision electronics such as military equipment. Therefore, in recent years, many researchers have conducted extensive research on flexible and rigid boards. For example, Ganasan, J.R. et al. published in IEEE Transactions onFlectronics Packaging Manufacturing in January 2000, volume:...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K3/36
CPCH05K3/4691H05K2201/0909H05K3/0052H05K3/4611H05K2201/09127Y10T156/1052Y10T156/1064Y10T156/1062
Inventor 任琳苏莹林承贤
Owner AVARY HLDG (SHENZHEN) CO LTD
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