Method and substrate for producing multi-layer circuit board
A technology for multilayer circuit boards and manufacturing methods, which is applied in the field of multilayer circuit board manufacturing and the substrate field of making multilayer circuit boards, and can solve the problems of multilayer circuit board manufacturing technology that needs to be developed, board explosion, and bubbles that cannot be better eliminated, etc. question
Inactive Publication Date: 2011-03-30
AVARY HLDG (SHENZHEN) CO LTD +1
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Problems solved by technology
For this reason, during the production process of multi-layer circuit boards, high-temperature and high-pressure reliability tests will be carried out on multi-layer circuit boards. However, the tiny air bubbles existing in traditional multi-layer circuit boards will Substantial expansion occurs, resulting in partial rupture of the multilayer circuit board, that is, the "explosion board" phenomenon
That is to say, the multilayer circuit board produced by the traditional method, because the tiny air bubbles between the layers cannot be well removed, the application of the multilayer circuit board is limited by the environmental conditions.
[0004] In order to broaden the application field of multilayer circuit boards, so that multilayer circuit boards can withstand the test of various harsh temperature and pressure conditions, the production technology of multilayer circuit boards needs to be developed.
Method used
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[0012] The method for manufacturing a multilayer circuit board provided by the technical solution and the substrate used for manufacturing the multilayer circuit board will be further described below in conjunction with the drawings and embodiments.
[0013] see figure 1 , a substrate 100 for making a multilayer circuit board provided by the first embodiment of the technical solution.
[0014] A multilayer circuit board is usually formed by pressing at least one double-sided circuit board and at least one single-sided circuit board. Therefore, the substrate 100 for making a multilayer circuit board can be a single-sided copper-clad substrate for forming a single-sided Circuit board; it can also be a double-sided copper-clad substrate, which is used to form a double-sided circuit board, so that the formed single-sided circuit board and double-sided circuit board are pressed together to form a multilayer circuit board. In this embodiment, the substrate 100 is a single-sided cop...
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The invention relates to a substrate used for manufacturing multilayer circuit board, which comprises a plurality of circuit board unit regions, peripheral regions and at least one first air guide groove disposed in the peripheral regions. A first air guide groove is formed on the peripheral region of the substrate used for manufacturing multilayer circuit board, thereby, when a plurality of substrates are pressed to form a multilayer circuit board, the air between the adjacent layers are discharged into the first air guide groove in the pressing process; thus, the air between the layers of the multilayer circuit board can be eliminated as possible, and the layers of the multilayer circuit board can be combined more tightly.
Description
technical field [0001] The invention relates to the field of printed circuit boards, in particular to a method for manufacturing a multilayer circuit board and a substrate for manufacturing a multilayer circuit board. Background technique [0002] A multilayer printed circuit board is a printed circuit board in which more than two layers of conductive lines and insulating materials are alternately bonded together and the interlayer conductive lines are interconnected according to design requirements. Multilayer printed circuit boards have been widely used because of their advantages such as high assembly density, see literature Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res. density multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425. There are many types of multilayer printed circuit boards, such as rigid, flexible, and combination of soft and hard. Multilayer flexible...
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IPC IPC(8): H05K3/46H05K1/02
Inventor 王成文李文钦何东青林承贤
Owner AVARY HLDG (SHENZHEN) CO LTD