Chip film cutting apparatus

Abstract

A chip membrane-cutting device is provided with a membrane-punching upper seat, a membrane-punching lower seat, a membrane-out unit, a membrane-receiving unit and a bearing unit, wherein, the membrane-punching upper seat is provided with a plurality of upper tool holders, the membrane-punching lower seat is provided with a plurality of lower tool holders, and the inner diameter of the lower tool holder is less than or equal to the diameter of a chip; the membrane-out unit and the membrane-receiving unit are respectively arranged at the two sides of the membrane-punching upper seat and the membrane-punching lower seat, thereby leading the membrane body to be rightly arranged between the membrane-punching upper seat and the membrane-punching lower seat; the upward side of the membrane-punching upper seat is provided with an adsorption disk corresponding to the upper and lower tool holders; the inner side of the adsorption disk is provided with at least one pre-paste unit, so the efficacy for cutting a membrane body with the area less than or equal to that of the chip is reached, a plurality of membrane bodies can also be simultaneously cut, and thus the efficacy for changing the cutting size can be achieved.

Description

technical field [0001] The invention relates to a film cutting device, in particular to a chip film cutting device which utilizes upper and lower die film seats located above the chip to cut the film so as to cut a film body larger than or equal to the area of ​​the chip. Background technique [0002] The existing chip cutting device uses a rectangular film material and attaches the film material to the chip, and then removes the excess part with a laser or a diamond knife. In order to prevent the laser or diamond knife from contacting the chip, the cut film material It is bound to be larger than the chip area, but in conjunction with the chip manufacturing process, it is necessary to reserve a circle around the chip without attaching the film material. Therefore, the existing technology uses exposure or development to remove excess film material, but this method increases the number of steps in the process and Cost, in order to improve this technology, the film material is ...

AI Technical Summary

Problems solved by technology

[0006] However, this existing method utilizes the circular blade on the outer periphery of the chip, and uses the lower piston rod positioned at the center to carry the chip to move the chip and the film downwards, and cooperates with the downward movement of the upper piston rod to cut the film, but because the blade is It is located on the outer periphery of the chip, so the cut film must be larger than the chip, and it cannot meet the requirement that the film is smaller than the chip, and the circular blade of this existing equipment is set on the outer periphery of the lower piston rod that carries the chip, so if It is very complicated to change the size of the circular blade, which is not easy to use in the process

[0007] Furthermore, the above two existing methods can only complete the film cutting and film attachment of one unit of chips at a time, so the overall production capacity is bound to be limited. If a large number of machines are purchased to produce the same process, the cost is very high, which does not meet the cost considerations

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