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Silicon chip cutter

A silicon wafer cutting fluid and cutting machine technology, which is applied to work accessories, fine work devices, stone processing equipment, etc., can solve the problems of time-consuming, time-consuming, and cumbersome adjustment of grinding wheel dressing.

Inactive Publication Date: 2012-05-09
无锡开源太阳能设备科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, for the grinding machine, the grinding wheel needs to be replaced to grind different workpieces, and the replacement of the grinding wheel is cumbersome to adjust on the one hand, and on the other hand, the dressing of the grinding wheel takes time and is time-consuming.

Method used

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Embodiment Construction

[0017] See figure 1 , figure 2 , Figure 6 , Figure 7 , the present invention includes a take-up and take-off structure, a workpiece clamping and releasing device, and a cooling device for silicon wafer cutting fluid. The take-up and take-off structure includes a winding motor and a take-off motor 1. Wheel 11 and pay-off wheel 2, the steel wire on the pay-off wheel 2 walks around the lifting wheel 10, the wheel group and then winds around the adjustment wheel 13 after the two guide wheels 12 and 7 arranged in parallel (the wheel group includes guide wheels) Wheels 4, 14, 15), then along another wheel set (wheel set includes guide wheels 19, 17, 18), 14, 15) and another lifting wheel ( figure 2 Covered by the guide wheel 17) around the winding wheel 11. Lifting wheel 10 and another lifting wheel are installed on rotating shaft 16 respectively, and rotating shaft 16 is installed on one end of fork 5 respectively, and the other end of fork 5 is installed in support 6 respe...

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Abstract

The invention provides a silicon slice cutting machine without frequently replacing components for different work pieces, which can ensure the surface quality of silicon slice and the pass rate in the process of rapidly cutting silicon slices. The invention consists of a wire retracting structure, a work piece tightening and releasing device and a silicon cutting liquid cooling device. The invention is characterized in that the wire retracting structure consists of a coiling motor and a releasing motor and the coiling motor and the releasing motor are respectively connected with a coiling wheel and a releasing wheel; the steel wire on the releasing wheel in turn passes a lifting wheel and a wheelset, then two horizontally arranged guide wheels and an adjusting wheel and finally the coiling wheel along another wheelset and another lifting wheel; the work piece tightening and releasing device consists of a mounting rack, a work piece connection structure, a cylinder and a top rod device; the silicon cutting liquid cooling device consists of a shell body and the inside of the shell body is divided into an outlet cavity, an inlet cavity and a thermal exchange cavity; the thermal exchange cavity is provided with a cooling pipe in the middle and the cooling pipe communicates the outlet cavity with the inlet cavity.

Description

(1) Technical field [0001] The invention relates to the technical field of silicon wafer cutting equipment, in particular to a silicon wafer cutting machine. (2) Background technology [0002] Traditional equipment for cutting silicon wafers usually uses a grinding machine for grinding and cutting, and the grinding process plays an important role in the industry. Its main features are the fine chips produced, high processing accuracy, and the self-sharpening of the grinding wheel, which makes the grinding A range of advantages. Now the industry has done a lot of experimental research on the ultra-precision grinding of brittle materials such as single crystal silicon. The research results show that for brittle materials such as single crystal silicon, the surface roughness is mainly related to the average abrasive grain size and feed rate of the grinding wheel. factors. When using an ultra-precision grinding machine and grinding under the grinding conditions of Vs=1200m / min...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/04B28D7/04
Inventor 陈世强张宏兵吕洪明
Owner 无锡开源太阳能设备科技有限公司
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