Improved cooling apparatus for silicon chip cutting liquor
A technology of silicon wafer cutting fluid and cooling device, which is applied to fine working devices, electrical components, semiconductor/solid-state device manufacturing, etc., and can solve problems such as large particles, high viscosity, and difficult cleaning
Inactive Publication Date: 2011-03-23
无锡开源太阳能设备科技有限公司
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Problems solved by technology
Due to the high viscosity of the cutting fluid, silicon powder and steel wire abrasive chips will flow into the cutting fluid during the cutting process. In the past, the cooler used a plate heat exchanger, which was prone to dead corners, difficult to clean, and formed large particles after a long time. Silicon wafer cutting The size of the abrasive is required to be within a certain range. If there are large particles, there will be quality defects such as line marks on the surface of the silicon wafer.
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[0009] See figure 1 , figure 2 , the present invention includes a housing 4, the interior of the housing 4 is divided into a cutting fluid outlet chamber, a liquid inlet chamber and a heat exchange chamber, the upper end and the lower end of the heat exchange chamber are respectively provided with a cooling water inlet 12 and a water outlet 6, and the cutting fluid outlet The liquid chamber and the liquid inlet chamber are respectively arranged at the upper end and the lower end of the housing 4, and the heat exchange chamber located in the middle is provided with a cooling pipe 5 inside, and the cooling pipe 5 communicates the cutting fluid outlet chamber and the liquid inlet chamber. Both the cutting fluid outlet chamber and the inlet chamber include fixed flanges 13, 7 and sealing heads 10, 2, and the fixing flanges 13, 7 are installed on the upper and lower ends of the housing 5 respectively; the fixing flanges 13, 7 and the sealing heads 10 and 2 are respectively connec...
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The invention relates to a device for cooling an improved silicon chip cutting fluid, which has the advantages of even exchange effect, no dead corner and convenient cleaning, and ensures the cutting quality. The device comprises a shell, the interior of the shell is separated into a cutting fluid outlet cavity, a cutting fluid inlet cavity and a heat exchange cavity, and the upper end and the lower end of the heat exchange cavity are provided with a cooling fluid inlet and a cooling fluid outlet respectively. The device is characterized in that the cutting fluid outlet cavity and the cuttingfluid inlet cavity are arranged at the upper end and the lower end of the shell respectively, a cooling pipeline is arranged in the heat exchange cavity which is positioned in the middle part, and the cutting fluid outlet cavity is communicated with the cutting fluid inlet cavity through the cooling pipeline.
Description
(1) Technical field [0001] The invention relates to the technical field of silicon wafer cutting, in particular to an improved cooling device for silicon wafer cutting fluid. (2) Background technology [0002] In the semiconductor industry and the solar energy industry, multi-wire cutting machines are often used to process silicon rods into silicon wafers. The cutting wires of multi-wire cutting machines use copper-plated stainless steel wires. The cutting fluid is brought into the cutting area, and the free abrasive on the surface of the steel wire is driven by the pressure and speed of the steel wire to cut the silicon wafer. The cutting fluid after cutting flows into the mortar bucket for recycling. A large amount of heat is generated during the cutting process, and the temperature of the cutting fluid rises after cutting. There are strict requirements on the temperature of the cutting fluid during the silicon wafer cutting process, so the cutting fluid must be cooled be...
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IPC IPC(8): H01L21/301B28D5/00
Inventor 陈世强施军胡宏波
Owner 无锡开源太阳能设备科技有限公司