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Stiffening plate and stiffening flexible circuit board comprising same

A flexible circuit board and reinforcing board technology, applied in printed circuit parts, synthetic resin layered products, layered products, etc., can solve problems such as increasing the difficulty of electronic components, and achieve convenient operation and not easy to warp , the effect of improving structural stability

Active Publication Date: 2011-03-23
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the coefficient of thermal expansion (Coefficient of Thermal Expansion, CET) of PI and epoxy resin is different. When the adhesive layer 120 is heated, the expansion and contraction of the two layers are different, which may easily cause warping of the reinforced FPCB 10 and increase the difficulty of subsequent surface mount electronic components.

Method used

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  • Stiffening plate and stiffening flexible circuit board comprising same
  • Stiffening plate and stiffening flexible circuit board comprising same
  • Stiffening plate and stiffening flexible circuit board comprising same

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Embodiment Construction

[0017] The reinforcing plate provided by the embodiment of the technical solution and the reinforced flexible circuit board including the reinforcing plate will be further described in detail below with reference to the drawings and multiple embodiments.

[0018] Since the actual thickness of the reinforcing plate is very thin and has the same structure along the width direction, in order to clearly show the structure of the reinforcing plate, the structure of the reinforcing plate will be described in detail below in conjunction with the enlarged partial section of the reinforcing plate (such as figure 2 , image 3 and Figure 4 shown). Similarly, the structure of the reinforced flexible circuit board (such as Figure 5 and Figure 6 shown) for easy understanding.

[0019] see figure 2 , the reinforcement plate 20 provided in the first embodiment of the technical solution is used for attaching to the flexible circuit board to improve the mechanical properties of the fl...

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Abstract

The invention provides a stiffening plate, which is formed by at least one polyamide layer and at least one polyamide-imide layer which are arranged in an alternating mode. The polyamide-imide layer is made of a polyamide-imide material represented by a general structure formula A, wherein Ar and Ar' represent aryl groups. The invention also provides a stiffening flexible circuit board comprisingthe stiffening plate. The stiffening flexible circuit board is insusceptible to warpage and good in structural stability.

Description

technical field [0001] The invention relates to the technical field of flexible circuit boards, in particular to a reinforcing board and a reinforced flexible circuit board comprising the reinforcing board. Background technique [0002] With the continuous development of foldable electronic products such as folding mobile phones and slider mobile phones, flexible printed circuit boards (Flexible Printed Circuit Board, FPCB), which are light, thin, short, small and bendable, are widely used in electronic products In order to realize the electrical connection between different circuits. In order to obtain FPCB with better flexural properties, improving the flexural properties of base film materials used in FPCB has become a research hotspot. See the literature Electrical Insulation Maganize, Volume 5, Issue 1, Jan.-Feb., 1989 Papers: 15-23, "Applications of Polyimide Films to the Electrical and Electronic Industries in Japan". [0003] In order to meet the multifunctional de...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02B32B27/08
Inventor 赖永伟郭呈玮刘兴泽
Owner AVARY HLDG (SHENZHEN) CO LTD