Reinforcing plate and reinforced flexible circuit board including the same

A technology of flexible circuit boards and reinforcing boards, applied in the direction of circuit substrate materials, printed circuits, printed circuits, etc., can solve the problems of increasing the difficulty of electronic components, achieve convenient operation, not easy to warp, and improve structural stability Effect

Active Publication Date: 2009-07-01
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the coefficient of thermal expansion (Coefficient of Thermal Expansion, CET) of PI and epoxy resin is different. When the adhesive layer 120 is heated, the expansion and contraction of the two layers are different, which may easily cause warping of the reinforced FPCB 10 and increase the difficulty of subsequent surface mount electronic components.

Method used

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  • Reinforcing plate and reinforced flexible circuit board including the same
  • Reinforcing plate and reinforced flexible circuit board including the same
  • Reinforcing plate and reinforced flexible circuit board including the same

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Embodiment Construction

[0017] The reinforcing plate provided by the embodiment of the technical solution and the reinforced flexible circuit board including the reinforcing plate will be further described in detail below with reference to the drawings and multiple embodiments.

[0018] Since the actual thickness of the reinforcing plate is very thin and has the same structure along the width direction, in order to clearly show the structure of the reinforcing plate, the structure of the reinforcing plate will be described in detail below in conjunction with the enlarged partial section of the reinforcing plate (such as figure 2 , image 3 and Figure 4 shown). Similarly, the structure of the reinforced flexible circuit board (such as Figure 5 and Figure 6 shown) for easy understanding.

[0019] see figure 2 , the reinforcement plate 20 provided in the first embodiment of the technical solution is used for attaching to the flexible circuit board to improve the mechanical properties of the fl...

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Abstract

The invention provides a stiffening plate, which is formed by at least a layer of polyimide and at least a layer of polyetherimide which are in alternative arrangement. The polyetherimide layer is made of a polyetherimide material; and the general formula of the structure of the polyetherimide material is A. The invention further provides a stiffening flexible circuit board comprising the stiffening plate. The stiffening flexible circuit board has the advantages of little possibility of warping and better structural stability.

Description

technical field [0001] The invention relates to the technical field of flexible circuit boards, in particular to a reinforcing board and a reinforced flexible circuit board comprising the reinforcing board. Background technique [0002] With the continuous development of foldable electronic products such as folding mobile phones and slider mobile phones, flexible printed circuit boards (Flexible Printed Circuit Board, FPCB), which are light, thin, short, small and bendable, are widely used in electronic products In order to realize the electrical connection between different circuits. In order to obtain FPCB with better flexural properties, improving the flexural properties of base film materials used in FPCB has become a research hotspot. Please refer to the literature Electrical Insulation Maganize, Volume 5, Issue 1, Jan.-Feb., 1989 Papers: 15-23, "Applications of Polyimide Films to the Electrical and Electronic Industries in Japan". [0003] In order to meet the multif...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03B32B27/08
CPCH05K1/0393H05K3/007H05K2203/0156H05K2201/0195H05K2201/0154Y10T428/265Y10T428/31721
Inventor 赖永伟郭呈玮刘兴泽
Owner AVARY HLDG (SHENZHEN) CO LTD
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