Manufacture method for layer-adding circuit board
A manufacturing method and circuit board technology, applied in circuits, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as low wiring density, complex process, and inability to meet users, so as to reduce manufacturing costs and reduce the thickness of finished boards. Effect
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[0114] see Figure 1 to Figure 31 Shown are the schematic diagram of the production process of the present invention, the schematic cross-section of the double-sided substrate of the present invention, and the schematic cross-section of the two-layer substrate of the present invention. Figure 1 , The schematic cross-section of the two-layer substrate of the present invention Figure II , The schematic cross-section of the two-layer substrate of the present invention Figure three , The schematic cross-section of the two-layer substrate of the present invention Figure four , The schematic cross-section of the three-layer substrate of the present invention Figure 1 , The schematic cross-section of the three-layer substrate of the present invention Figure II , The schematic cross-section of the three-layer substrate of the present invention Figure three , The schematic cross-section of the three-layer substrate of the present invention Figure four , The schematic cross...
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