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Copper core layer multilayer packaging substrate manufacturing method

A technology for encapsulating substrates and manufacturing methods, which is applied in the directions of multilayer circuit manufacturing, metal core circuit manufacturing, semiconductor/solid-state device manufacturing, etc., and can solve problems such as difficulty in making copper core substrates, inability to meet users, and low wiring density, and achieve Improve the warping problem, simplify the packaging process, and improve the reliability

Inactive Publication Date: 2011-10-12
BRIDGE SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this manufacturing method is not only difficult to manufacture the copper core substrate, but also has the same disadvantages as the above method, such as low wiring density and complicated process.
Therefore, the commonly used ones cannot meet the needs of users in actual use.

Method used

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  • Copper core layer multilayer packaging substrate manufacturing method
  • Copper core layer multilayer packaging substrate manufacturing method
  • Copper core layer multilayer packaging substrate manufacturing method

Examples

Experimental program
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Embodiment Construction

[0094] see figure 1 Shown is a schematic diagram of the production process of the present invention. As shown in the figure: the present invention is a method for manufacturing a copper core layer multilayer packaging substrate, which at least includes the following steps:

[0095] (A) Provide copper core substrate 11: provide a copper core substrate;

[0096] (B) Forming the first dielectric layer and the first metal layer 12: directly pressing a first dielectric layer and a first metal layer on the first surface of the copper core substrate, or first bonding the first dielectric layer After a dielectric layer, the first metal layer is formed;

[0097] (C) Forming several first openings 13: forming several first openings on the first metal layer and the first dielectric layer by laser drilling, and exposing part of the first surface of the copper core substrate, wherein , Several first openings can be formed by opening copper windows (Conformal Mask) first, and then forme...

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PUM

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Abstract

A copper core layer multilayer packaging substrate manufacturing method is a single surface and multilayer packaging substrate for starting manufacturing by taking the copper core substrate as a base. The structure comprises a thick copper plate with high rigidity, and one surface of the thick copper plate has a build-up circuit, while the other surface has a ball side pattern barrier. The mode for connecting its crystal providing side and ball side with various build-up circuits is that they are communicated by a plurality of electroplating blind holes and buried holes. Therefore, The inventive packaging substrate is characterized by including a high-density build-up circuits for providing the coiling required by connecting of electronic assembly, and simultaneously using a thick copper plate to provide enough rigidity to make the packaging process to be more easier. Therefore, the multilayer packaging substrate manufactured by the invention can form copper core layer multilayer packaging substrate supported by a copper core substrate, and can effectively improve plate bending problem of ultrathin nuclear layer substrate and simplify the making flow of conventional build-up circuit board, thereby achieving the object of improving the reliability when the packaging body is jointed to the substrate.

Description

technical field [0001] The invention relates to a method for manufacturing a copper core layer multilayer packaging substrate, in particular to a method for manufacturing a single-sided, multilayer packaging substrate based on the copper core substrate. Background technique [0002] In the production of general multi-layer packaging substrates, the production method usually starts with a core substrate, and then completes a double-sided structure of the inner core board through drilling, metal plating, plug holes, and double-sided circuit production. A multi-layer packaging substrate is then completed through a circuit build-up process. Such as Figure 21 As shown, it is a schematic cross-sectional view of a package substrate with a nucleated layer. First, a core substrate 50 is prepared, wherein the core substrate 50 is composed of a core layer 501 with a predetermined thickness and a circuit layer 502 formed on the surface of the core layer 501, and several electroplated ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H05K3/44H05K3/46
Inventor 林文强王家忠陈振重
Owner BRIDGE SEMICON
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