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Tungsten metallization-multilayer alumina black porcelain substrate and preparation method thereof

A multi-layer alumina and metallization technology, which is applied in the field of co-fired ceramics, can solve problems affecting product yield, achieve high flatness, good bonding, and offset mismatching effects

Pending Publication Date: 2022-07-12
NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the actual production process, there are usually some sintering defects in the sintering process of tungsten metallization-multilayer alumina ceramics. The warping caused by the mismatch between the slurry and the alumina porcelain, these warping problems greatly affect the yield of the product

Method used

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  • Tungsten metallization-multilayer alumina black porcelain substrate and preparation method thereof
  • Tungsten metallization-multilayer alumina black porcelain substrate and preparation method thereof
  • Tungsten metallization-multilayer alumina black porcelain substrate and preparation method thereof

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preparation example Construction

[0028] A first aspect of the present invention provides a method for preparing a tungsten metallization-multilayer alumina black ceramic substrate, comprising the following steps:

[0029] Preparation of laminates

[0030] The preparation of the laminated body in the present invention is basically the same as the conventional laminated body preparation process in the field, that is, the tungsten paste is printed on the green ceramic tape and laminated. Among them, in the embodiment of the present invention, firstly, multiple sheets of alumina green ceramic tapes with a certain thickness in the same batch are selected, and tungsten paste is evenly printed on the front and back sides of one green ceramic tape, and the rest of the green ceramic tapes are not Do the printing process; then stack the green ceramic tapes in sequence, and then stack them, wherein the green ceramic tapes with the tungsten paste evenly printed on the front and back sides are located on the top layer. ...

Embodiment 1

[0037] In the present embodiment, the preparation of tungsten metallization-multilayer alumina black ceramic substrate, the specific steps are as follows:

[0038] Green Porcelain Printing: Select 3 pieces of alumina green porcelain with a thickness of 0.25mm from the same batch, and evenly print tungsten paste on the front and back of one piece of green porcelain, while the other two pieces of green porcelain are not printed;

[0039] Green porcelain isostatic pressing: press the printed three pieces of green porcelain figure 1 (The top layer of Al 2 O 3 The front and back sides of the porcelain are printed with tungsten paste) sequentially stacked, and the stacking process conditions are 60 ° C, 2000 psi;

[0040] Raw cut: Cut the laminated green porcelain into 200×200mm squares;

[0041]Co-firing: put the green body into a high-temperature sintering furnace, vacuumize the furnace cavity to a degree of vacuum less than 1Pa at room temperature, and then introduce a mixed g...

Embodiment 2

[0045] In the present embodiment, the preparation of tungsten metallization-multilayer alumina black ceramic substrate, the specific steps are as follows:

[0046] Green Porcelain Printing: Select 3 pieces of alumina green porcelain with a thickness of 0.25mm from the same batch, and evenly print tungsten paste on the front and back of one piece of green porcelain, while the other two pieces of green porcelain are not printed;

[0047] Green porcelain isostatic pressing: press the printed three pieces of green porcelain figure 1 Sequential lamination, lamination process conditions are 60 ° C, 2000 psi;

[0048] Raw cut: Cut the laminated green porcelain into 200×200mm squares;

[0049] Co-firing: put the green body into a high-temperature sintering furnace, vacuumize the furnace cavity to a degree of vacuum less than 1Pa at room temperature, and then introduce a mixed gas of nitrogen and wet hydrogen (nitrogen / wet hydrogen v / v=1:3); 2°C / min to 550°C, hold for 2h; then rise t...

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Abstract

The invention discloses a tungsten metallization-multilayer aluminum oxide black porcelain substrate and a preparation method thereof, the main process of the preparation method comprises the following steps: providing a laminated body, and printing tungsten slurry on the front and back surfaces of a green porcelain tape on the top layer of the laminated body; cutting the laminated body to obtain a green body; the green body is subjected to high-temperature co-firing, specifically, after reaction equipment is vacuumized, mixed gas of nitrogen and wet hydrogen is introduced, the temperature is increased to 500-600 DEG C at the speed of 1-3 DEG C / min, and heat preservation is conducted for 1-3 h; the temperature is increased to 900-1000 DEG C at the speed of 1-3 DEG C / min, and heat preservation is conducted for 20 And finally, the temperature is increased to 1500-1650 DEG C at the speed of 1-2 DEG C / min, heat preservation is conducted for 1-3 h, and natural cooling along with Through the process improvement in the invention, the warping problem of the prepared tungsten metallization-multilayer aluminum oxide black porcelain substrate is obviously improved, and the black porcelain substrate has high flatness.

Description

technical field [0001] The invention belongs to the technical field of co-fired ceramics, in particular to a preparation method of a tungsten metallization-multilayer alumina black ceramic substrate, and also relates to a tungsten metallization-multilayer alumina black ceramic substrate prepared by the preparation method . Background technique [0002] Alumina high temperature co-fired ceramic (HTCC) has excellent material properties, such as high insulation, high strength, high hardness, high temperature resistance, wear resistance, so it is widely used in semiconductor integrated circuits, At the same time, semiconductor circuits have significant photosensitivity, and the encapsulated ceramic shell is generally required to have light-shielding properties. Therefore, the preparation of tungsten metallized alumina high-temperature co-fired black ceramics is of great significance for the development of the field of semiconductor packaging. [0003] Among them, the preparatio...

Claims

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Application Information

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IPC IPC(8): C04B35/10C04B35/622C04B35/638C04B35/64C04B41/88
CPCC04B35/10C04B35/622C04B35/638C04B35/64C04B41/88C04B41/5133C04B2235/6582C04B2235/6562C04B2235/6567C04B2235/96C04B41/4539C04B41/4578C04B41/0072
Inventor 郑亮张迪刘念强李天赐吴刚秦智晗马涛丁小聪
Owner NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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