Optical module and manufacturing method thereof

Abstract

The invention discloses an optical module, comprising a substrate and a chip welded with the substrate by adopting a flip chip bonding method, wherein the gap between the substrate and the chip is filled and sealed by transparent silica gel, and the substrate and the exterior of the chip are encapsulated by pouring sealant. The invention also discloses a manufacturing method of the optical module. In the invention, common pouring sealant is adopted, and a secondary pouring process is utilized, thus the problem of encapsulation failure caused by mismatching of CTE (coefficient of thermal expansion) of the chip and the substrate in the optical module is successfully solved.

Description

technical field [0001] The invention relates to an optical module and a manufacturing method thereof, in particular to an optical module and a chip flip-chip packaging method thereof. Background technique [0002] Flip-chip bonding (FCB) is a method of direct mounting and interconnection between chips and substrates. The chip faces down, and the pads on the chip are directly connected to the pads on the substrate. Therefore, the interconnection wire is very short, and the stray capacitance, interconnection resistance and interconnection inductance generated by interconnection are much smaller than wire bonding and tape automated bonding, which is more suitable for high Frequency, high-speed electronic products. The substrate area occupied by FCB chip mounting and interconnection is small, and the chip mounting density is high. Moreover, the chip bonding area of ​​FCB can be arranged in an area array, which is more suitable for LSI and VLSI chips with high I / O count. Since...

AI Technical Summary

Problems solved by technology

[0007] Aiming at the difference in CTE between the chip and the substrate of the above optical modules, part of the chip functions will fail after colloid potting. Package failure caused by substrate CTE mismatch

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