Controlled ambient system for interface engineering

Abstract

The present invention discloses a cluster architecture and methods for processing a substrate. The cluster architecture includes a lab-ambient controlled transfer module that is coupled to one or more wet substrate processing modules. The lab-ambient controlled transfer module and the one or more wet substrate processing modules are configured to manage a first ambient environment. A vacuum transfer module that is coupled to the lab-ambient controlled transfer module and one or more plasma processing modules is also provided. The vacuum transfer module and the one or more plasma processing modules are configured to manage a second ambient environment. And, a controlled ambient transfer module that is coupled to the vacuum transfer module and one or more ambient processing modules is also included. The controlled ambient transfer module and the one or more ambient processing modules are configured to manage a third ambient environment. The cluster architecture therefore enables controlled processing of the substrate in either the first, second or third ambient environments, as well as during associated transitions. The embodiments also provide for efficient methods for filling a trench of a substrate.

Description

Background technique [0001] Typically, semiconductor processing is performed in a highly controlled manner, with tightly controlled environments and tool operations. For example, the clean rooms in which these tools are housed must meet stringent requirements and other controlled parameters that limit the number of particles that may be generated during operation. During the process, it may be required to move the substrate multiple times between many systems, and to repeat the movement between the systems as many times as necessary to process the required equipment, required layers and required structures of the integrated circuit device. [0002] Although semiconductor equipment must meet strict regulations to qualify the production of semiconductor wafers, these regulations are usually mostly associated with individual tools. In operation, if a substrate needs to be processed in a wet tool, the substrate will have to be transferred to another tool, possibly dry, after the ...

AI Technical Summary

Problems solved by technology

Although the cleanroom environment is controlled and decontaminated, exposure to oxygen during substrate movement can cause oxidation of substrate features or layers before the next operation is performed

Most of the time, manufacturing procedures are known to include additional oxide removal steps, requiring more cost and cycles due to exposure of substrates to oxygen during cleanroom transport

However, even after the oxide removal step is performed, the waiting time before proceeding to the next step may still result in some oxidation

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