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Method for calibrating vertical survey system of photo-etching machine stage

A calibration method and measurement system technology, applied in the field of calibration, to achieve the effect of improving calibration accuracy and convenient operation

Active Publication Date: 2010-12-29
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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Problems solved by technology

[0007] The object of the present invention is to provide a calibration method for the vertical measurement system of the workpiece table of a lithography machine, which uses the silicon wafer pre-alignment platform of the lithography machine or other platforms to rotate the silicon wafer, so as to solve the problem caused by the unevenness of the silicon wafer. The system error problem caused by the calibration of the vertical measurement system improves the calibration accuracy

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  • Method for calibrating vertical survey system of photo-etching machine stage
  • Method for calibrating vertical survey system of photo-etching machine stage
  • Method for calibrating vertical survey system of photo-etching machine stage

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[0046] The method for calibrating the vertical measurement system of the workpiece table of the lithography machine proposed by the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0047] At present, high-precision lithography machines have a silicon wafer pre-alignment platform and a workpiece table. The workpiece table is used to carry the silicon wafer. The silicon wafer pre-alignment platform has the function of rotating the silicon wafer. The workpiece table is connected to the vertical measurement system of the workpiece table. , The workpiece table vertical measurement system includes a leveling sensor and a linear adjustable differential sensor. For details, please refer to figure 1 , which is a schematic diagram of an arrangement of the workpiece table vertical measurement system in a lithography machine. The linear adjustable differential sensor includes a first sensor 11, a second s...

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Abstract

The invention provides a method for calibrating a vertical survey system of a photo-etching machine stage, a silicon chip self-contained by the photo-etching machine is pre-aligned with the stage or other stages so that the silicon chip is rotated, combined with a leveling sensor, gain matrix and offset of a linear adjustable difference sensor can be calibrated; compared with the traditional calibration method, the operation is convenient, solving the effect on calibrating the linear adjustable difference sensor caused by the unevenness of the silicon chip and improving the calibration preciseness.

Description

technical field [0001] The invention relates to a calibration method, in particular to a calibration method for a vertical measurement system of a workpiece table of a lithography machine. Background technique [0002] The vertical measurement system of the workpiece table of the lithography machine usually includes: a focus level sensor (Focus level sensor, referred to as FLS) and a linear variable differential sensor (linear variable differential transfer, referred to as LVDT). Among them, the leveling sensor emits a laser signal to the upper surface of the silicon wafer to form a light spot. After being emitted by the silicon wafer, it monitors the position of the reflected light, and then determines the attitude of the upper surface of the silicon wafer, that is, by measuring the height of the upper surface of the silicon wafer. , to calculate the attitude of the workpiece table. The linear adjustable differential sensor uses three sensors to calculate the attitude of t...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/03G01B21/02
Inventor 马雨雷程吉水
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD