Solid-state imaging device and manufacturing method thereof, and electronic apparatus and manufacturing method thereof
一种固体摄像元件、制造方法的技术,应用在电固体器件、电气元件、半导体器件等方向,能够解决不能角度修正等问题
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[0070] First, the outline of the present invention will be described before describing the specific embodiments of the present invention.
[0071] In the solid-state imaging device and electronic device of the present invention, a rod-shaped (rod-shaped) member made of a light-transmitting material is provided on each pixel instead of an on-chip lens. The rod-shaped member is a member for guiding incident light to a light receiving portion such as a photodiode, and is made of a light-transmitting material.
[0072] Here, with Figure 15 In the same manner as shown, the operation when light is obliquely incident is compared in the structure provided with the conventional on-chip lens and the structure provided with the rod-shaped member of the present invention, and is shown in Figure 4 .
[0073] Figure 4 (A) represents a conventional structure provided with an on-chip lens, Figure 4 (B) shows the structure provided with the rod-shaped member of this invention. The widt...
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