Semiconductor luminous element

Abstract

The invention relates to a semiconductor luminous element, which comprises a shell, a heat conductor, a semiconductor chip, a packaging colloid and a fluorescent layer. The shell is provided with a base wall and a peripheral wall which protrudes upwards from the upper surface periphery of the base wall, the base wall center forms a punch hole, the base wall and the peripheral wall define a groove together, and the wall surface around the groove is a diffusing surface. The heat conductor is arranged on the lower surface side of the base wall, and partial area of the heat conductor is positioned on the bottom side of the punch hole to make the punch hole form an inner groove. The semiconductor chip is arranged on the heat conductor and positioned in the inner groove. The packaging colloid is covered on the semiconductor chip and fills the inner groove and the groove. The fluorescent layer is covered on the surface of the packaging colloid.

Description

technical field [0001] The invention relates to a semiconductor light-emitting element for lighting, in particular to a semiconductor light-emitting element that diffuses light to improve light extraction efficiency. Background technique [0002] Semiconductor light-emitting elements for general lighting usually use light-emitting diodes (LEDs) as light sources, and are equipped with a fluorescent layer. The light emitted by the light source illuminates the fluorescent layer and excites the phosphor powder in the fluorescent layer to emit light, so that the semiconductor light-emitting element can produce a predetermined color. of light. [0003] At present, the arrangement of the fluorescent layer generally adopts the method of conformal coating or indirect coating (remote phosphor). Corner coating is to distribute the fluorescent layer around the LED chip. Indirect coating is to make the fluorescent layer and the light-emitting diode chip be separated by a certain distan...

AI Technical Summary

Problems solved by technology

[0004] However, since the light emitting diode chip also absorbs reflected light, most of the light collected towards the light emitting diode chip is absorbed by the chip, resulting in a decrease in light extraction efficiency.

[0005] In addition, due to the smooth surface of the reflector, the combination with the packaging colloid is poor, and it is easy to infiltrate moisture, which has a negative impact on the performance of the LED chip

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