Method for packaging light emitting diode
A technology for light-emitting diodes and packaging methods, which is applied to semiconductor devices, electrical components, circuits, etc., and can solve problems such as inability to respond to design changes quickly, delaying production schedules, and deformation.
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[0025] Figure 1A~Figure 1E It is a schematic cross-sectional view of a light emitting diode packaging method according to an embodiment of the present invention. Please refer first Figure 1A Firstly, a light-emitting diode chip 110 and a carrier 120 are joined, so that the light-emitting diode chip 110 and the carrier 120 are electrically connected. The aforementioned carrier 120 generally refers to any carrier that can carry the light-emitting diode chip 110 and can be electrically connected to the light-emitting diode chip 110. In this embodiment, the carrier 120 may be a printed circuit board (PCB), and the printed circuit board is made of ceramic material or plastic material, for example. In addition, the printed circuit board can also be a metal core printed circuit board (MCPCB) or a flexible printed circuit board (Flexible Printed Circuit) with good heat dissipation characteristics. In other words, the light emitting diode 100 in this embodiment is manufactured using die...
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