Heat dissipating structure and producing method thereof

Abstract

The invention discloses a heating dissipating structure and a producing method thereof; the heat dissipating structure is applied to the heat energy generating position in an electronic device; the heat dissipating structure comprises a metal matrix and a carbon composite material layer which is formed on the metal matrix; the carbon composite material layer is formed in a manner that a plurality of carbon particles covered by a metal layer on the surface thereof are sintered; the carbon composite material layer can be also formed in a manner that metal particles and the carbon particles are sintered with each other. When in use, the heating dissipating structure has the heat dissipating effect of the traditional vapor chamber and the traditional heat spreader. The heat dissipating structure consists of the carbon composite material layer and a high thermal-conductivity metal plate, and is adhered to a heat generating electronic element for heat exchange, thus having good heat dissipating effect.

Description

technical field [0001] The present invention relates to a heat dissipation structure and a manufacturing method, and relates to a heat dissipation structure and a manufacturing method that is applied to a heat generating place inside an electronic device to rapidly absorb heat energy and release heat energy. It belongs to the technical field of heat dissipation. Background technique [0002] Among the components of electronic devices, there are many components that can generate high temperature and high heat, including central processing units, laser diodes, light-emitting diodes, microwave generators, etc., and with the improvement of computer performance, the power of these components will become higher and higher , and its circuits will become more and more dense, making the heat generated by these components higher and higher, and the heat is becoming more and more difficult to get rid of, so that the temperature of these components gradually exceeds the allowable upper ...

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Problems solved by technology

[0008] However, in the above-mentioned conventional technology, although the heat conduction structure 10 has good heat conduction characteristics, its manufacturing process needs to be carried out in an environment of high temperature and high pressure, which will cause a large increase in manufacturing cost, and it is not easy to control the temperature and pressure. When the temperature is too high or the pressure is too high, there is a risk of damaging the diamond particles 12, s

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