Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Flexible circuit board

A technology of flexible circuit boards and conductive materials, applied in printed circuits, printed circuits, circuit devices, etc., can solve problems such as inability to transmit high-speed differential signals

Inactive Publication Date: 2009-10-21
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
View PDF4 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the differential pair 51 is transmitted on the signal layer, common mode noise will be generated because the copper foil grids on the ground layer corresponding to the differential transmission line 52 and the differential transmission line 54 are different, which is why ordinary flexible circuit boards cannot transmit high-speed Reason for Differential Signaling

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flexible circuit board
  • Flexible circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] Please refer to figure 2 A preferred embodiment of the flexible printed circuit board of the present invention includes a signal layer 10 and two ground layers 30 located above and below the signal layer 10 respectively, and a layer of insulation is filled between the signal layer 10 and each ground layer 30 Medium 20. A differential pair 11 includes two differential transmission lines 12 and 14 and is routed on the signal layer 10 . On each ground layer 30, the part vertically opposite to the differential transmission lines 12 and 14 is hollowed out to avoid the low impedance of the transmission line caused by the vertical distance between the differential pair 11 and the adjacent ground layer 30 being too short The non-hollowed part of each ground layer 30 has a horizontal distance d1 from its adjacent differential transmission line 12 or 14, figure 2 The material covered on each ground layer 30 is copper foil, and the rectangular hollow area 32 in the center is f...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a flexible circuit board, which comprises at least one signal layer; a ground plane is respectively arranged above and below the signal layer; a layer of insulating medium is filled between the signal layer and the insulating layer; the signal layer is laid with a differential pair which comprises two differential transmission lines; the part of each ground plane which is perpendicular and opposite to the differential pair is a hollow area; both edges of the hollow area on each ground plane respectively have a first horizontal spacing with the adjacent differential transmission line thereof. The flexible circuit board can transmit high speed signals and eliminate the common mode noise derived from a gridding ground plane in the prior art. The flexible circuit board does not need to add additional cost and only needs to adjust the existing wiring mode.

Description

technical field [0001] The invention relates to a flexible circuit board, in particular to a flexible circuit board capable of transmitting high-speed differential signals. Background technique [0002] Flexible circuit boards are printed circuit boards made of flexible insulating substrates, which have many advantages that rigid printed circuit boards do not have. For example, the thickness of the flexible circuit board is relatively thin, and it can be bent, wound, and folded freely, and can be arranged arbitrarily according to the requirements of the space layout, and can be moved and stretched arbitrarily in the three-dimensional space, so as to achieve the integration of component assembly and wire connection. The use of flexible circuit boards can greatly reduce the size of electronic products, and is suitable for the development of electronic products in the direction of high density, miniaturization, and high reliability. Therefore, flexible circuit boards have been...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/46
CPCH05K2201/0969H05K1/0245H05K1/0393H05K2201/09336H05K1/0253H05K1/0224H05K2201/09236Y10T29/49156
Inventor 白育彰许寿国刘建宏
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products