Diaphragm for speaker, frame for speaker, dust cap for speaker, speaker and apparatus using them, and method for manufacturing component for speaker

A manufacturing method and speaker technology, applied in the field of devices, to achieve the effects of improving water resistance reliability, high elastic modulus, and preventing secondary agglomeration

Active Publication Date: 2009-10-21
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0021] However, in the conventional method of manufacturing speaker parts such as the diaphragm 101, the resin diaphragm 101 is only limited by the material pro...

Method used

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  • Diaphragm for speaker, frame for speaker, dust cap for speaker, speaker and apparatus using them, and method for manufacturing component for speaker
  • Diaphragm for speaker, frame for speaker, dust cap for speaker, speaker and apparatus using them, and method for manufacturing component for speaker
  • Diaphragm for speaker, frame for speaker, dust cap for speaker, speaker and apparatus using them, and method for manufacturing component for speaker

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0101] Next, use figure 1 ˜ FIG. 4 describe Embodiment 1 of the present invention. figure 1 It is a cross-sectional view of speaker 10 in Embodiment 1 of the present invention. figure 2 is used for figure 1 The illustrated speaker 10 is a cross-sectional view of a speaker diaphragm 1 (hereinafter, referred to as a diaphragm 1 ). image 3 yes figure 2 A top view of the vibrating plate 1 is shown. Figure 4A yes figure 2 A partially detailed cross-sectional view of the vibrating plate 1 is shown. Figure 4B is used for figure 1 The partial detailed cross-sectional view of the loudspeaker diaphragm 1 which is another form of the loudspeaker 10 shown.

[0102] Such as figure 1 As shown, speaker 10 has diaphragm 1 , magnetic circuit 5 , speaker housing 7 a (hereinafter referred to as housing 7 a ), and voice coil 8 . The magnetic circuit 5 is formed by sandwiching the magnetized magnet 2 between the upper clamp 3 and the yoke 4 . The frame body 7 a is connected to...

Embodiment approach 2

[0145] Next, Embodiment 2 of the present invention will be described using the drawings. In addition, the same reference numerals are assigned to the same configuration as in the first embodiment, and detailed description thereof will be omitted.

[0146] Figure 5 It is a cross-sectional view of speaker 10a in Embodiment 2 of the present invention. Image 6 is used for Figure 5 The shown speaker 10a is a cross-sectional view of a speaker housing 7 (hereinafter referred to as housing 7). Figure 7 yes Image 6 A partially detailed cross-sectional view of frame 7 is shown.

[0147] Compared with the speaker 10 in the first embodiment, the speaker 10a in the second embodiment replaces the diaphragm 1 in the first embodiment with a speaker diaphragm 1a (hereinafter referred to as a diaphragm 1a), and replaces the frame body 7a with a frame. body7. Other configurations of the speaker 10a of the second embodiment are the same as those of the speaker 10 of the first embodimen...

Embodiment approach 3

[0177] Next, Embodiment 3 of the present invention will be described using the drawings. In addition, the same code|symbol is attached|subjected to the same structure as Embodiment 1, 2, and detailed description is abbreviate|omitted.

[0178] Figure 8 It is a cross-sectional view of speaker 10b in Embodiment 3 of the present invention. Figure 9 is used for Figure 8 A cross-sectional view of a speaker dustproof cover 11 (hereinafter, referred to as a cover 11 ) of the speaker 10b shown. Figure 10 yes Figure 9 A partially detailed cross-sectional view of cover 11 is shown.

[0179] Compared with speaker 10 in Embodiment 1, speaker 10 b in Embodiment 3 has diaphragm 1 in Embodiment 1 replaced with diaphragm 1 a and cover 11 a replaced with cover 11 . Other configurations of the speaker 10b of the third embodiment are the same as those of the speaker 10 of the first embodiment. Furthermore, in the speaker 10b in Embodiment 3, compared with the speaker 10a in Embodiment...

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Abstract

A diaphragm for a speaker (1) is formed of a composite (15) containing a resin (16) and a bamboo fiber (17) included therein. This constitution can provide a diaphragm (1) which can simultaneously realize advantages of the bamboo fiber (17) such as a high sound quality and a high level of freedom in setting of property values of the diaphragm (1) and advantages of the resin diaphragm (1) such as improved moisture resistance reliability or strength, excellent appearance, and improved productivity and dimensional stability.

Description

technical field [0001] The present invention relates to a speaker diaphragm, a speaker frame, a speaker dust cover, a speaker using them, a stereo set, a TV set, a mobile body, etc., and a speaker used for various audio equipment or video equipment. Method of manufacturing parts. Background technique [0002] Use below Figure 14 , to describe previous speakers. Figure 14 It is a cross-sectional view of the conventional speaker. [0003] Such as Figure 14 As shown, speaker 110 has speaker diaphragm 101 (hereinafter referred to as diaphragm 101 ), magnetic circuit 105 , speaker housing 107 (hereinafter referred to as housing 107 ), and voice coil 108 . The magnetic circuit 105 is formed by clamping the magnetized magnet 102 between the upper clamp 103 and the yoke 104 . The frame body 107 is connected to the yoke 104 . The outer periphery of the diaphragm 101 is connected to the outer peripheral portion of the frame body 107 via an edge 109 . The central portion of diap...

Claims

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Application Information

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IPC IPC(8): H04R7/02H04R1/02H04R9/02H04R31/00
Inventor 梶原义道沟根信也三村和义鲭户隆史西村和晃
Owner PANASONIC CORP
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