Adhesive compound, method for modifying adhesive and product made from the modified adhesive
A composition and technology of silicon pressure-sensitive adhesives, applied in the directions of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of unsatisfactory application, weak bonding strength of silicone materials, etc., and achieve good bonding the effect of strength
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Embodiment 1
[0040] Trimethyl borate (3 parts by weight) and Degussa DCLBP-50-PSI (6 parts by weight) were uniformly dispersed in a solution containing 100 parts by weight of ShinEtsu KRT-002 polydimethylsiloxane pressure-sensitive adhesive by stirring. The resulting pressure-sensitive adhesive composition having a solids content of 40% was then coated on a 0.025 mm PET film and immediately dried at 70° C. for 1 minute. The dried glue was then cured at 165°C for 2 minutes. The thickness of the obtained dry glue was 0.040mm.
Embodiment 2
[0042]Trimethyl borate (5 parts by weight) and CAT-PL-50T catalyst (ShinEtsu) (0.83 parts by weight) were added to a solution containing 100 parts by weight of ShinEtsu KR3700 polydimethylsiloxane pressure-sensitive adhesive, and in Stir to disperse evenly. The resulting pressure-sensitive adhesive composition having a solids content of 40% was then coated on a 0.025 mm PET film and immediately dried at 70° C. for 1 minute. The dried glue was then cured at 130°C for 2 minutes. The thickness of the obtained dry glue was 0.040mm.
Embodiment 3
[0044] Tributyl borate (28 parts by weight) and A75 (3 parts by weight) was added to a solution containing 100 parts by weight of Momentive PSA610 polydimethylsiloxane pressure-sensitive adhesive, and dispersed evenly under stirring. The resulting pressure-sensitive adhesive composition having a solids content of 40% was then coated on a 0.025 mm PET film and immediately dried at 70° C. for 1 minute. The dried glue was then cured at 177°C for 2 minutes. The thickness of the obtained dry glue was 0.040 mm.
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