Method for forming conducting wire on insulated heat-conducting metal substrate in a vacuum sputtering way
A metal substrate, vacuum sputtering technology, applied in conductive pattern formation, vacuum evaporation plating, printed circuit and other directions, can solve the problems of poor thermal performance, related to waste water treatment, etc., to achieve environmental protection, good thermal conductivity, process process simple effect
Inactive Publication Date: 2012-07-18
MITAC PRECISION TECH(KUNSHAN) CORP
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Problems solved by technology
[0002] Traditional insulating and heat-conducting substrates, such as FR4 printed circuit boards (PCBs), have a thermal conductivity (K) of about 0.36W / m·K. Spray conductive paint on the substrate in sequence, electroless copper plating, and then etch out the circuit printed copper foil circuit. The disadvantage of electroless copper plating is that the process involves environmental problems such as wastewater treatment.
[0003] At present, there is no method of directly using vacuum sputtering to make conductive lines on insulating and heat-conducting metal substrates.
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[0008] see figure 1 As shown, the method for forming conductive lines by vacuum sputtering on the insulating and heat-conducting metal substrate of the present invention comprises the following steps:
[0009] Step 201: providing a metal base material, wherein the material of the metal base material is magnesium alloy (such as AZ31B) or aluminum alloy;
[0010] Step 202: Perform pretreatment on the metal substrate to clean the surface of the metal substrate, wherein the pretreatment includes degreasing, pickling, and cleaning;
[0011] Step 203: Perform hard anodic oxidation on the metal substrate to form a layer of porous film, wherein the hard anodic oxidation is carried out under the condition of direct current or pulse, and the thickness of the film is 15-25 μm;
[0012] Step 204: Post-processing the metal substrate, the post-processing includes cleaning and drying;
[0013] Step 205: Coating a layer of high thermal conductivity adhesive on the metal substrate, the high ...
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Abstract
The invention discloses a method for forming a conducting wire on an insulated heat-conducting metal substrate in a vacuum sputtering way, which comprises the following steps: the metal substrate is provided; the metal substrate is preprocessed so as to clean the surface of the metal substrate; a porous film is arranged on the metal substrate in a hard anodizing way; the metal substrate is post-processed; high heat-conducting glue is coated on the metal substrate; the outer layer of the metal substrate coated with the high heat-conducting glue is sputtered with a metal conducting layer and a metal protecting layer; a conductor part of an etch-resisting film shielding circuit diagram is etched to remove a nonconductor part and then an etch-resisting film is removed; and liquid photosensitive welding-resisting ink is printed. The invention has simple process, best heat conduction and environmental-friendly process.
Description
【Technical field】 [0001] The invention relates to a method for forming a conductive circuit on an insulating substrate, in particular to a method for forming a conductive circuit on an insulating and heat-conducting metal substrate by using a vacuum sputtering process. 【Background technique】 [0002] Traditional insulating and heat-conducting substrates, such as FR4 printed circuit boards (PCBs), have a thermal conductivity (K) of about 0.36W / m·K. The substrate is sprayed with conductive paint, electroless copper plating, and then etched out the circuit printed copper foil circuit. The disadvantage of electroless copper plating is that the process involves environmental problems such as wastewater treatment. [0003] At present, there is no method of directly using vacuum sputtering to make conductive lines on an insulating and heat-conducting metal substrate. 【Content of invention】 [0004] The main purpose of the present invention is to provide a method for forming cond...
Claims
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IPC IPC(8): H05K3/10H05K3/16C23C14/34C23C14/02C23C14/54C23C14/14C25D11/02C23F1/16
Inventor 郭雪梅吴政道
Owner MITAC PRECISION TECH(KUNSHAN) CORP