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Packaging cover plate of organic electroluminescence device

A technology for electroluminescent devices and encapsulation cover plates, which is applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., can solve the problems of performance degradation, shortening and speeding up the life of OLED devices, and achieves overcoming the lack of sealing and improving the service life. Effect

Inactive Publication Date: 2011-02-16
IRICO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The OLED device encapsulated by the traditional OLED device packaging cover plate has accelerated the penetration of water and oxygen due to curing defects, porosity, and weak bonding force with the substrate of the sealant, which leads to rapid degradation of OLED device performance and shortened lifespan.

Method used

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  • Packaging cover plate of organic electroluminescence device
  • Packaging cover plate of organic electroluminescence device
  • Packaging cover plate of organic electroluminescence device

Examples

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Embodiment Construction

[0017] The present invention will be described in detail below, which is an explanation of the present invention rather than a limitation.

[0018] Referring to Fig. 1, the present invention provides a packaging cover plate 1 of an organic electroluminescent device. Compared with the existing packaging cover plate, the packaging ring 3 provided on the packaging surface 2 around it has a thickness of 10 to 50 Microns, height is 2-20 microns.

[0019] Referring to FIG. 2 , the present invention also provides a packaging cover plate 1 in which the packaging surface 2 includes two packaging rings 3 , and the distance between the two packaging rings 3 is 5-50 microns.

[0020] Referring to Fig. 3, the two packaging rings 3 are non-continuous packaging rings 3, the length of the packaging section 4 constituting each discontinuous packaging ring is 50-800 microns, and the distance between adjacent packaging sections 4 is 200-800 microns The gap segment 5, the packaging segment 4 and...

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Abstract

The invention discloses a packaging cover plate of an organic electroluminescence device. A packaging face on the periphery of the packaging cover plate is provided with raised packaging rings with a width of 10 to 50 microns and a height of 2 to 20 microns; the packaging rings are two packing rings arranged at an interval of 5 to 50 microns or two discontinuous packaging rings having alternatelyarranged packaging and clearance sections. The packaging cover plate of the organic electroluminescence device disclosed by the invention is a packaging glass cover plate or a packaging stainless steel cover plate; by the design of an annular raised packaging ring structure on the smooth packaging face on the periphery of the packaging cover plate, the defect that the leak tightness of the plane structure of the prior packaging face is poor is overcome; and through the interaction and tight combination of the packaging rings and ultraviolet curing packaging adhesive, the defect that the packaging is not tight enough due to porosity of the packaging adhesive is overcome; penetration of oxygen and water vapor into the OLED device is effectively prevented; and the service life of the OLED device can be remarkably improved.

Description

technical field [0001] The invention belongs to the technical field of flat panel display and relates to a packaging cover plate of an organic electroluminescent device. Background technique [0002] Stable luminescence is the first problem to be solved to realize the commercialization of organic electroluminescent devices (OLEDs). Most organic substances in the OLED light-emitting layer are very sensitive to pollutants, oxygen, and water vapor in the atmosphere. Oxygen and the carbonyl compound generated by the oxidation of the light-emitting layer are effective quenchers, which will significantly reduce the luminous quantum efficiency of the OLED; water vapor will hydrolyze the organic layer compound and affect the conductivity, resulting in a greatly reduced stability; used for OLED cathodes Metal materials are mostly chemically active metals, which are easily corroded in the air or other atmospheres containing oxygen, especially in environments containing water vapor, w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/56
Inventor 张志刚
Owner IRICO