Packaging cover plate of organic electroluminescence device
A technology for electroluminescent devices and encapsulation cover plates, which is applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., can solve the problems of performance degradation, shortening and speeding up the life of OLED devices, and achieves overcoming the lack of sealing and improving the service life. Effect
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[0017] The present invention will be described in detail below, which is an explanation of the present invention rather than a limitation.
[0018] Referring to Fig. 1, the present invention provides a packaging cover plate 1 of an organic electroluminescent device. Compared with the existing packaging cover plate, the packaging ring 3 provided on the packaging surface 2 around it has a thickness of 10 to 50 Microns, height is 2-20 microns.
[0019] Referring to FIG. 2 , the present invention also provides a packaging cover plate 1 in which the packaging surface 2 includes two packaging rings 3 , and the distance between the two packaging rings 3 is 5-50 microns.
[0020] Referring to Fig. 3, the two packaging rings 3 are non-continuous packaging rings 3, the length of the packaging section 4 constituting each discontinuous packaging ring is 50-800 microns, and the distance between adjacent packaging sections 4 is 200-800 microns The gap segment 5, the packaging segment 4 and...
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