Unlock instant, AI-driven research and patent intelligence for your innovation.

Method of inspecting solder paste for printing and a device thereof

An inspection method and inspection device technology, which are applied in the direction of measuring devices, optical devices, and electrical components to assemble printed circuits, can solve the problems of solder paste printing volume increase and decrease, solder paste deformation, etc., to improve the printing process, Effect of preventing poor soldering

Inactive Publication Date: 2009-11-18
PANASONIC CORP
View PDF1 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in practice, due to various factors, the shape of the printed solder paste (hereinafter referred to as "printed shape") will be deformed, and the printed amount of solder paste will increase or decrease.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method of inspecting solder paste for printing and a device thereof
  • Method of inspecting solder paste for printing and a device thereof
  • Method of inspecting solder paste for printing and a device thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] Such as figure 1 As shown, the inspection device 10 according to this embodiment includes a height measurement mechanism 11, a shape data generation mechanism 12, a calculation mechanism 13, a feature extraction mechanism 14, a summary mechanism 15, a quality judgment mechanism 16, an output mechanism 17, and a control unit 18 .

[0047] The height measurement mechanism 11 measures the surface height of the solder paste 2 printed on the printed circuit board 1 by using a laser scanning method or an optical interference method, that is, the printed solder paste 2 at each coordinate position on the printed circuit board 1 2 for the height of the surface.

[0048] The shape data generating mechanism 12 receives the coordinate position and height information on the printed circuit board 1 from the height measuring mechanism 11, and generates each printed area for the area to be measured on the printed circuit board 1 provided by the control unit 18 in advance. Three-dime...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a method of representing the shape feature of a solder paste for the printing on a printed circuit board on the basis of a three-dimension measuring value of the solder paste for the printing on a printed circuit board. Firstly, data relating to the three-dimension shape of each solder paste for the printing on the pad or disk of the printed circuit board are generated, and the characteristic quantity representing the three-dimension shape of each solder paste for the printing is extracted on the basis of the data. The solder paste for the printing is then classified according to the extracted characteristic quantity, the number of the solder pastes for the printing of each classification is then calculated. The quality of the printing state is then judged on the basis of the calculated number of the solder pastes for the printing of each classification or the ratio thereof.

Description

technical field [0001] The present invention relates to a method for inspecting solder paste (also referred to as "solder paste") printed on a printed circuit board and an inspection device using the method. Method and apparatus for inspecting the shape and characteristics of solder paste printed on a substrate by three-dimensional measurement. Background technique [0002] In the manufacturing line for mounting electronic components on printed circuit boards, first, solder paste is selectively printed on pads or lands of printed circuit boards by a printing device, and then printed by The inspection device inspects the printed solder paste. Then, an electronic component is mounted on the printed circuit board subjected to the inspection of the printed solder paste by an electronic component mounting device. [0003] Generally, there are two types of devices for inspecting printed solder paste. One is a two-dimensional inspection device that detects the position and area ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/34G01B11/24G01B11/02G01B11/28G01B11/00G01B11/26G01N21/88
Inventor 冈本正规兼松宏一田中健太郎
Owner PANASONIC CORP