Test method of plastic material and integrated circuit
A technology of integrated circuits and detection methods, applied in the direction of optical testing defects/defects, optics, instruments, etc., which can solve problems such as missed detection, failure to normally include anisotropic conductive film 150, and influence on detection and judgment, and achieve the effect of simplifying the process
Inactive Publication Date: 2012-08-29
AU OPTRONICS (XIAMEN) CORP +1
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[0006] However, the above detection process has the following disadvantages: first, the detection frame 120 is a fixed-point detection frame, and when the charge-coupled device 140 or the machine 130 shakes, the detection frame 120 corresponding to the anisotropic conductive film 150 will be offset , that is, the anisotropic conductive film 150 cannot be included normally, and there is a problem of missed detection, which affects the detection and judgment; There is no reference, and it is impossible to know the position of the bonding area of the driving integrated circuit, so the pressing area of the subsequent driving integrated circuit may not cover the anisotropic conductive film 150, resulting in missed inspections
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[0031] The detailed description and technical content of the present invention are now described as follows in conjunction with the accompanying drawings. The following description of the embodiments refers to the accompanying figures to illustrate specific embodiments in which the invention can be practiced.
[0032] Please also refer to image 3 as well as Figure 4 , image 3 It is a flow chart of the detection method of the adhesive material 400 and the integrated circuit 450 according to the first embodiment of the present invention, Figure 4 It is a schematic diagram of a method for detecting whether the bonding condition between the adhesive material 400 and the integrated circuit 450 is good according to the first embodiment of the present invention. The detection method of the adhesive material and the integrated circuit of the present invention is to start the detection after the integrated circuit 450 is pre-pressed on the adhesive material 400 , and each step of ...
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The invention discloses a test method of a plastic material and an integrated circuit, comprising the following steps: defining a first datum box containing a first area with partial integrated circuit and a second area adjacent to the first area; storing gray scale pattern in the first datum box; defining a first test box; testing whether the gray scale pattern in the first test box accords with the gray scale pattern in the first datum box; and judging the attaching condition of the integrated circuit and the plastic material.
Description
technical field [0001] The invention discloses a detection method for adhesive materials and integrated circuits, in particular to a detection method for adhesive material attachment status and integrated circuit damage status. Background technique [0002] In the liquid crystal display panel, the function of the driving integrated circuit (Integrated Circuit, IC) is to output the required voltage to the pixel (Pixel), and control the twisting degree of the liquid crystal molecules. Therefore, whether the driving integrated circuit and other circuits in the liquid crystal display panel can have a good electrical connection will greatly affect the liquid crystal display panel. [0003] Currently, in the manufacturing process of liquid crystal display panels, the commonly used packaging technology for driving integrated circuits is Chip On Glass (COG). Chip-on-Glass is to install the driver integrated circuit directly on the glass substrate. Compared with the early stage that...
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IPC IPC(8): G01N21/95G02F1/13
Inventor 张智胜
Owner AU OPTRONICS (XIAMEN) CORP