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SMT fuse and manufacturing method thereof
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A surface mount, manufacturing method technology, applied in fuse manufacturing, emergency protection devices, electrical components, etc.
Active Publication Date: 2010-01-06
AEM COMPONENTS
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Problems solved by technology
[0007] Except for AEM's products, the fuses of miniature surface mount fuses currently on the market are all single-layer designs
Method used
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example 1
[0055] Coat the first slurry with a thickness of 0.01 inches on the substrate and cure with ultraviolet light.
[0056] A second layer of the first slurry with a thickness of 0.011 inches was coated on the cured first layer slurry and cured with ultraviolet light.
[0057] A fuse pattern made of the second paste is printed on the solidified second paste, and cured by ultraviolet rays.
[0058] Coat the surface with a 0.004 inch thick first paste and cure with UV light.
[0059] A fuse pattern using a second paste is printed on the cured paste and cured with ultraviolet rays.
[0060] Coat the first paste with a thickness of 0.01 inches on the surface and cure with ultraviolet light.
[0061] Coat the first paste with a thickness of 0.011 inches on the surface and cure with ultraviolet light.
[0062] The blank on the substrate is cut into individual fuses.
[0063] The cut fuse blanks are degummed at 300-400°C and sintered at 850-910°C to make a glass-ceramic body with two...
example 2
[0065] Coat the first slurry with a thickness of 0.01 inches on the substrate and cure with ultraviolet light.
[0066] A second layer of the first slurry with a thickness of 0.006 inches was coated on the cured first layer slurry and cured with ultraviolet light.
[0067] A fuse pattern using the second paste is printed on the solidified second paste, and cured with ultraviolet rays.
[0068] Coat the surface with a 0.005 inch thick first paste and cure with UV light.
[0069] A fuse pattern using a second paste is printed on the cured paste and cured with ultraviolet rays.
[0070] Coat the surface with a 0.004 inch thick first paste and cure with UV light.
[0071] A fuse pattern using a second paste is printed on the cured paste and cured with ultraviolet rays.
[0072] Coat the surface with a 0.005 inch thick first paste and cure with UV light.
[0073] A fuse pattern using a second paste is printed on the cured paste and cured with ultraviolet rays.
[0074] Coat th...
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Abstract
The invention provides an SMT fuse and manufacturing method thereof, including the steps that: a first paste composed of glass ceramicpowder and a first binding agent and a second paste composed of conducting material powder and a second binding agent are prepared; the first paste is coated on a substrate and cured; the second paste is coated on the cured first paste to form a preset pattern corresponding to a finished fuse and the second paste is cured; the first paste is coated on the cured second paste and cured; the formed fuse blank array is cut into individual fuse blanks; the fuse blanks are separated from the substrate or a strap; the binding agent in the first paste and the second paste of the blanks are removed by glue disintegration, and then the blanks are sintered to be glass ceramic devices containing a fuse therein; and terminal conducting material paste is adhered at the two ends of the glass ceramic devices, and the terminal conducting material layer is electrically connected with the end of the fuse, so as to form the terminal electrode of the fuse.
Description
technical field [0001] The invention relates to a method for manufacturing a surface-mounted fuse and the surface-mounted fuse, in particular to a method for manufacturing a miniature surface-mounted high-current fuse and the surface-mounted fuse manufactured by the method. Background technique [0002] Currently, printed circuit boards are increasingly used in various electrical and electronic devices. Circuits formed on these printed circuit boards generally require overcurrent protection. One way to provide this overcurrent protection is to use surface mount fuses mounted on the printed circuit board. [0003] At present, the miniature surface mount fuses on the market mainly use two types of materials, that is, organic and inorganic materials, as the base material of the fuse. The fuses are made of metal materials. [0004] US Patent 5,943,764 discloses one current approach to producing miniature surface mount fuses. In this scheme, metal fuses and terminal electrode...
Claims
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Application Information
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