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Special onboard computer

A computer and special technology, applied in calculation, instrument, electrical digital data processing, etc., can solve problems such as electrolytic capacitors, hard disk hazards, material aging failure, air density reduction, etc., achieve excellent anti-electromagnetic interference performance, improve anti-electromagnetic The effect of interference ability

Active Publication Date: 2010-01-13
EVOC INTELLIGENT TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

②As the air pressure decreases, the air density also decreases accordingly, resulting in a decrease in heat dissipation capacity. ③As the air pressure decreases, the on-off capability and electrical life of switching electrical products with free air as the arc-extinguishing medium are affected to a certain extent.
④The reduction or increase of air pressure and the increase of water pressure will increase the pressure difference between the inside and outside of the sealed container of the product, which will easily cause gas or liquid to leak outward or infiltrate from the sealed joint of the sealed container, and may even cause the container to rupture
There are such dangers in electrolytic capacitors and hard drives
⑤The reduction of air pressure will accelerate the volatilization or evaporation of the fillers and solvent substances contained in some materials, and promote the accelerated aging and failure of materials

Method used

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Embodiment Construction

[0031] Such as figure 1 Shown, a kind of airborne special computer comprises a case, is provided with host module 15, main board module 13 in the case, host module 15, main board module 13 are fixedly connected with case, case is assembled by case board, case board includes U-shaped Radiating plate 1, panel 2, back plate 4 and bottom plate 3, the outer surface of U-shaped cooling plate 1 is provided with cooling fins 6, and the end faces of U-shaped cooling plate 1, panel 2, back plate 4 and bottom plate 3 are all provided with mutual communication The sealing grooves 23 are provided with a seamless sealing ring 8 of an integral structure without splicing in all the sealing grooves 23, and the sealing ring 8 is a conductive rubber ring. After installing the U-shaped cooling plate 1, the panel 2, and the back plate 3, finally put the bottom plate 3 and fix it with screws. The connection is completely sealed. The chassis is made of aluminum alloy die-casting, which has strong ...

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PUM

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Abstract

The invention discloses a special onboard computer, which comprises a case; a host computer module and a mainboard module are arranged in the case and fixedly connected with the case, and the case is formed by splicing case boards; the end faces of each case board are provided with mutually communicated seal grooves; and the insides of all the seal grooves of the case boards are respectively provided with an integrated seamless sealing ring not spliced. The special onboard computer provided by the invention can be adapted to a low atmospheric-pressure environment at a high altitude of 10,000 meters, and has high tightness, high electromagnetic interference resistance, high shock resistance, good radiating effect and strong erosion resistance.

Description

technical field [0001] The invention relates to an airborne special computer, in particular to an airborne special computer suitable for high-altitude and low-pressure environments. Background technique [0002] With the continuous development and popularization of computer technology, its performance is becoming more and more excellent. Computers that can meet the harsh external working environment have been widely used in various fields of industrial production and people's lives. However, there are also special areas where there are no dedicated computers, such as airborne computers. The airborne computer needs to work in a low-pressure environment for a long time, requiring particularly high anti-low pressure sealing performance, anti-electromagnetic interference performance, heat dissipation performance, and shock resistance performance. At present, there is no sealing performance, anti-electromagnetic interference performance, shock resistance performance, and heat dis...

Claims

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Application Information

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IPC IPC(8): G06F1/16G06F1/18
Inventor 陈严炜
Owner EVOC INTELLIGENT TECH
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