Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates
A connection method and connection structure technology, which are applied in the field of flip-chip mounting bodies and connection structures between substrates, can solve problems such as poor connection, steam explosion, and no consideration, and achieve high connection between substrates and achieve the effect of reliability.
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no. 1 approach
[0058] Figure 1(a) to Figure 1(d) It is a cross-sectional view showing the steps of the connection method between substrates in the first embodiment of the invention.
[0059] As shown in Figure 1(a), a resin 14 containing conductive particles 15 and a bubble generating agent (not shown) is provided to a first substrate 10 formed with a plurality of first electrodes 11, and then a plurality of second electrodes 11 are formed. The second substrate 12 of the electrodes 13 is positioned and arranged. Here, the inter-substrate distance between the first substrate 10 and the second substrate 12 at the portion where the electrodes 11 and 13 are not formed is denoted as L 1 .
[0060] Step portions 16, 17 are provided at opposing positions of the first substrate 10 and the second substrate 12, respectively, and the distance L between the substrates between the step portions 16, 17 is 2 Narrower than L 1 . It should be added that the stepped portions 16 and 17 may be provided on...
no. 2 approach
[0089] Figure 5(a) to Figure 5(c) It is a figure showing the connection method between the substrates in the second embodiment of the present invention, and FIG. 5(a) is a perspective view thereof; FIG. 5(b) is a cross-sectional view on the Vb-Vb line of FIG. 5(a); FIG. 5 (c) is a cross-sectional view on the Vc-Vc line of FIG. 5(a). In addition, in this embodiment, the same components as those of the first embodiment are denoted by the same symbols. Note that parts that are not particularly described are the same as those of the first embodiment, and detailed description of these parts will be omitted.
[0090] As shown in Figure 5(a), a plurality of linear first electrodes 11 are formed on the first substrate 10, and stepped portions 16 parallel to the first electrodes 11 are formed outside the plurality of linear first electrodes 11. . Similarly, a plurality of linear second electrodes 13 are formed on the second substrate 12 , and stepped portions 17 parallel to the sec...
no. 3 approach
[0097] Fig. 9 (a) and Fig. 9 (b) are the figures showing the connection method between the substrates in the third embodiment of the present invention, Fig. 9 (a) is its plan view; Fig. 9 (b) is Fig. 9 (a) Cutaway view on line IXb-IXb. In addition, in this embodiment, the same components as those of the first embodiment are denoted by the same symbols. Note that parts that are not particularly described are the same as those of the first embodiment, and detailed description of these parts will be omitted.
[0098] As shown in FIG. 9( a ), a plurality of first electrodes 11 in an array are formed on the first substrate 10 , and a plurality of step portions 16 in an array are formed between adjacent first electrodes 11 . Similarly, a plurality of second electrodes 13 in an array are formed on the second substrate 12 , and a plurality of step portions 17 in an array are formed between adjacent second electrodes 13 .
[0099] As shown in FIG. 9( b ), in this embodiment, the firs...
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