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Tool setter of sharpening grinding wheel of semiconductor wafer

A tool setting device, semiconductor technology, applied in the direction of grinding device, semiconductor/solid device manufacturing, grinding/polishing equipment, etc., can solve the problems of slow feed speed, long stroke of the grinding wheel spindle, and low efficiency of semiconductor wafer grinding , to achieve the effect of shortening the idle stroke and improving the grinding efficiency

Inactive Publication Date: 2012-09-05
WUXI MACHINETOOL +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] During the semiconductor wafer grinding process, the grinding wheel will be continuously consumed when grinding the semiconductor wafer; the suction cup that absorbs the semiconductor wafer is trimmed, etc., which will cause the idle stroke of the grinding wheel to become larger and larger, due to the grinding wheel spindle. The feed rate is very slow, and since the idle stroke of the grinding wheel feed becomes larger and larger, the entire stroke of the grinding wheel spindle becomes longer and longer during grinding, which leads to low grinding efficiency of semiconductor wafers

Method used

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  • Tool setter of sharpening grinding wheel of semiconductor wafer
  • Tool setter of sharpening grinding wheel of semiconductor wafer

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Embodiment Construction

[0008] See figure 1 , the present invention comprises a grinding wheel spindle 1, a grinding wheel spindle feed device 2, a grinding wheel 3, and a suction cup 4, the grinding wheel 3 is set on the grinding wheel spindle 1, the suction cup 4 is located below the grinding wheel 3, and the space between the lower surface of the grinding wheel 3 and the upper surface of the suction cup 4 is installed There is a micro switch 5 with a height H, the bottom end of the micro switch 5 is equipped with a switch contact 6, the micro switch 5 is connected to the top of the rotating shaft 8 through the spring 7 mounted on the side, and the bottom of the rotating shaft 8 is connected to the swing cylinder 9, 10 among the figure is the fixed structure of sucker.

[0009] Its working principle is as follows: the swing cylinder 9 moves to make the top of the micro switch 5 contact the lower surface of the grinding wheel 3, the rotation of the grinding wheel spindle 1 drives the grinding wheel ...

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Abstract

The invention relates to a tool setter of a sharpening grinding wheel of a semiconductor wafer. The invention can complete the tool setting of the grinding wheel before the semiconductor wafer is sharpened, shorten the idle stroke of a main shaft of the grinding wheel during sharpening and enhance the sharpening efficiency of the semiconductor wafer. The tool setter of the sharpening grinding wheel of the semiconductor wafer comprises the main shaft of the grinding wheel, a feeding device of the main shaft of the grinding wheel, the grinding wheel and a sucking disk. The tool setter of the sharpening grinding wheel of the semiconductor wafer is characterized in that a microswitch with determined height is arranged in a space on the lower surface of the grinding wheel and the upper surfaceof the sucking disk, one end of the microswitch is provided with a switch contact, and the microswitch is connected with a driving device by a connecting piece arranged at the side part.

Description

(1) Technical field [0001] The invention relates to the technical field of semiconductor wafer processing devices, in particular to a semiconductor wafer grinding wheel tool setting device. (2) Background technology [0002] During the semiconductor wafer grinding process, the grinding wheel will be continuously consumed when grinding the semiconductor wafer; the suction cup that absorbs the semiconductor wafer is trimmed, etc., which will cause the idle stroke of the grinding wheel to become larger and larger. The feed rate is very slow, and since the idle stroke of the grinding wheel becomes larger and larger, the entire stroke of the grinding wheel spindle becomes longer and longer during grinding, which leads to low grinding efficiency of the semiconductor wafer. (3) Contents of the invention [0003] In view of the problems referred to above, the invention provides a kind of semiconductor wafer grinding wheel tool setting device, which can complete the tool setting of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/04B24B7/22H01L21/02B24B37/34
Inventor 吕洪明郭东明康仁科储湘华朱祥龙
Owner WUXI MACHINETOOL
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