Liquid refrigerating chip for semiconductor laser and preparation method thereof

Abstract

The invention relates to a liquid refrigerating chip for a semiconductor laser and a preparation method thereof. The liquid refrigerating chip comprises a refrigerating chip body, wherein, the refrigerating chip body is in a polygonal flaky shape; a fixed through-hole is vertically opened at the middle part of the refrigerating chip body; a liquid inlet through-hole and a liquid outlet through-hole are arranged on two sides of the fixed through-hole respectively; a radiating fin is arranged in the liquid inlet through-hole; and a chip mounting area is arranged at one end of the refrigerating chip body, which is adjacent to the liquid inlet through-hole. The liquid refrigerating chip has the advantages of not only simple fabrication, low fabrication cost and simple use and maintenance, butalso high heat-dissipation capability, high reliability and low requirements for sealing.

Description

technical field [0001] The invention belongs to the field of laser manufacturing, and relates to a cooling sheet, in particular to a liquid cooling sheet for semiconductor lasers and a preparation method thereof. Background technique [0002] At present, power electronic devices have been widely used in industry, national defense and other fields, with huge market demand and extremely broad development prospects. As the power of electronic devices increases, so do their coolers. The performance of power electronic devices is not only related to the chip, but also closely related to its packaging and heat dissipation. In order to improve the power, reliability and performance stability of power electronic devices and reduce production costs, it is necessary to design a highly reliable packaging structure and an efficient heat dissipation structure. Therefore, it is necessary to design and manufacture low-cost and high-efficiency refrigerators. [0003] In the prior art, th...

AI Technical Summary

Problems solved by technology

[0005] 1. High cost of use and maintenance: Since the cooling liquid of the refrigerator is in direct contact with the positive and negative electrodes of the electronic device, high-quality deionized water must be used as the cooling medium during work to prevent the positive and negative electrodes from being connected

The cost of deionized water is high, and the low conductivity of deionized water must be maintained when it is used, so the use and maintenance costs are high

[0006] 2. Difficulty in processing: Micro-channel liquid coolers are usually formed by stacking several layers of thin copper sheets. The internal micro-channel is about 300 microns. During the manufacturing process, each layer of copper sheet needs to be precisely processed , so that the laminated microchannels form a turbulent flow with strong heat dissipation when the liquid flows through

Therefore, the precise machining of microchannel refrigerators is a difficult point

[0007] 3. High manufacturing cost: Since the precision machining of micro-channel refrigerators is quite difficult, its manufacturing cost is also very high

[0008] 4. Short service life: During the working process of power electronic devices, if there are impurities in the cooling medium, these impurities are easily attached to the inner wall of the microchannel

These impurity particles will cause electrochemical corrosion of the microchannel tube wall, and in severe cases, the tube wall of the microchannel refrigerator may be corroded, which will greatly affect the safety of the device

These all seriously affect the service life of power electronic devices

[0009] 5. High sealing requirements: Since the flow space of the cooling medium in the microchannel refrigerator is very narrow, it is easy to generate redundant pressure drop, resulting in device failure

[0010] To sum up, neither the thermal conduction cooling type nor the microchannel liquid cooling type can fully meet the requirements of high-power semiconductor lasers.

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