Flexible circuit board as well as hot-pressed device and method for manufacturing same

Abstract

The invention relates to a flexible circuit board as well as a hot-pressed device and a method for manufacturing the same. The flexible circuit board comprises a main part and a contact part, wherein the contact part is arranged at one end of the main part; the main part comprises a first insulation layer, a plurality of conductive lines and a protecting layer; the conductive lines are arranged between the first insulation layer and the protecting layer; the contact part comprises a second insulation layer connected with the first insulation layer of the main part; the second insulation layercomprises a contact surface and a bottom surface opposite to the contact surface; the surface of the contact surface is provided with a plurality of conductive terminals for being electrically connected with an external line; the conductive terminals are electrically connected with the conductive lines of the main part, and a reinforced layer is covered on the bottom surface. The invention has simple structure, simple and convenient assembly and multiple functions. The flexible circuit board is difficultly influenced by the thermal expansion factor and can improve the press precision when being pressed with an external electronic element.

Description

technical field [0001] The invention relates to a flexible circuit board, a thermocompression bonding device for manufacturing the flexible circuit board and a method for manufacturing the flexible circuit board. Background technique [0002] With the vigorous development of semiconductor technology and material science, the application of driver chips and flexible circuit boards is becoming more and more extensive. Flexible printed circuit boards are flexible and bendable, and can be embedded in conductors in various shapes to meet the needs of equipment, so that two electronic components are electrically connected. [0003] The flexible circuit board in the prior art generally includes an insulating layer, multiple conductive lines, multiple conductive terminals and a protective layer. The plurality of conductive circuits are arranged on the surface of the insulating layer. The plurality of conductive terminals are used for electrical connection with external circuits, w...

AI Technical Summary

Problems solved by technology

[0004] However, in the prior art, the plurality of conductive terminals of the flexible circuit board are only disposed on an insulating layer, so that when the plurality of conductive terminals of the flexible circuit board are thermocompressively bonded with external electronic components, they will expand due to heat. The coefficient has a great influence, and it is easy to cause unevenness of hot pressing alignment, and then produce defects such as hot pressing deviation, thereby reducing the production yield of products

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