Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Cross purge valve and container assembly

A container and cross technology, applied in semiconductor/solid-state device manufacturing, multi-way valves, valve devices, etc., can solve problems such as pollution, rust, and disadvantages

Active Publication Date: 2010-02-24
VERSUM MATERIALS US LLC
View PDF0 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In addition, these chemicals often may react unfavorably with moisture and / or oxygen in the air
Such reactions may lead to contamination by by-product impurities which may clog the vessel or transfer line and cause rust or contamination or both

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cross purge valve and container assembly
  • Cross purge valve and container assembly
  • Cross purge valve and container assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] The present invention relates to a container for high purity process chemicals having improved valves and improved purge purge in the non-dispensing mode of the container.

[0016] Such containers are frequently used in the semiconductor manufacturing industry, the photovoltaic industry and other industries where precise control and a high degree of cleanliness and purity of the process chemicals are very important.

[0017] In the semiconductor manufacturing industry, these containers are typically constructed of glass, especially quartz, or metal, such as stainless steel. Steel containers are typically electropolished or surface treated to remove particles and produce a smooth surface that is easy to clean and prevents unwanted surface adsorption of the process chemicals.

[0018] High purity process chemicals in the semiconductor manufacturing industry typically have metal impurity specifications preferably no greater than parts per billion (ppb) levels and preferabl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention is a quartz bubbler container with cross purge capability, this cross purge allows the user to easily purge air and chemical from the valve inlet and outlet by simply flowing inert gas, and avoids the requirement for a more complicated vacuum purging apparatus. The design incorporates two small footprint 3-way valves mounted on the bubbler container inlet and outlet connectors. The 3rd port of each valve is piped together between the valves with a crosspurge line. The valves are corrosion resistant, leak free, maintenance free, non-leaching of impurities, and can accommodate an optional breakseal crusher that will perforate quartz break seals (on the inlet and outlet of ampoule). Liquid out containers of various materials of construction are also contemplated.

Description

[0001] Cross References to Related Applications [0001] This patent application claims the benefit of US Provisional Patent Application No. 61 / 091,155, filed August 22, 2008. technical field The present invention relates to a container and valve-cross purge assembly for storing and dispensing high purity process chemicals. Background of the invention [0002] The semiconductor manufacturing industry uses a range of chemical formulations in solid, liquid and gas phases for storage and distribution under standard temperature and pressure, eg ambient conditions. These chemical formulations can have widely varying vapor pressures and viscosities based on their chemical structure, and whether they are in their pure form or contained in solvents. [0003] The semiconductor manufacturing industry typically uses chemicals used to fabricate semiconductor devices such as integrated circuits, memory devices, and optoelectronic devices by dispensing the chemicals from containers of v...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B65D83/00H01L21/00
CPCF16K11/02B67D7/0283B67D7/0272B08B9/00B08B9/0826B08B9/08B67D7/0294Y10T137/8376H01L21/02
Inventor C·M·伯特彻T·A·斯泰德尔J·E·巴克
Owner VERSUM MATERIALS US LLC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products