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Preparation method for PCB plate with step trough

A technology of PCB boards and stepped grooves, which is applied in the manufacture of printed circuits, the formation of electrical connections of printed components, and electrical components. It can solve problems such as patch processing, step grooves that cannot be patterned, and green oil protection, and achieve volume reduction. Effect

Active Publication Date: 2010-03-03
SHENNAN CIRCUITS
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Problems solved by technology

[0008] The technical problem to be solved by the present invention is to provide a method for preparing a PCB board with stepped grooves, so as to solve the problems that the stepped grooves of the PCB board in the prior art cannot be patterned, green oil protection, patch processing, etc.

Method used

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  • Preparation method for PCB plate with step trough

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Embodiment Construction

[0027] Please also refer to figure 1 , the present invention mainly utilizes twice pressing method to make PCB board 30 with step groove 6, mainly comprises the following steps: prepare sub-boards 10 and 20, and make positioning holes (not shown) in board edge; and prepare mother board 30.

[0028] Please also refer to figure 1 (a), the sub-board 10 is a patterned laminated structure with through holes 1 drilled therein, and circuits (not shown) are formed in the sub-board 10 . The manufacturing method of sub-board A mainly includes: inner layer manufacturing, pressing, drilling, desmearing, copper sinking, electroplating, plugging, micro-etching, outer pattern (outer layer image formation), outer etching (outer layer image etching ) and other process steps. The sub-board 10 can be prepared by using the method for preparing a PCB board in the prior art. The inner layer production includes forming circuits on each inner layer core board by developing, etching, etc., and the...

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Abstract

The invention relates to a preparation method for a PCB plate with a step trough, which comprises the following steps: a sub-plate one and a sub-plate two are prepared and compressed to prepare a motherboard, wherein the sub-plate one is formed by laminating and compressing an inner layer, the sub-plate two forms a green oil protective layer on a position to be formed with the step trough after laminating and compressing an inner layer. Steps for preparing the motherboard are as follows: a gasket is put on the green oil protective layer of the sub-plate two; the sub-plate one is laminated on the sub-plate two; dielectric layers are added between the two sub-plates and the periphery of the gasket and the green oil protective layer; the laminated sub-plates are compressed to form a motherboard; the motherboard is drilled with a through hole, is plated with copper and electroplated; and finally the motherboard is milled with a trough till reaching the position of the gasket; the excess PCB is taken out with the gasket to form the step trough. The invention adopts a secondary compression method, is simple, convenient and reliable, can form a pattern and the green oil protective layer at the bottom of the step trough, and further can paste and install electronic devices.

Description

technical field [0001] The invention relates to the manufacture of printed circuit boards, in particular to a method for preparing a PCB board with stepped grooves. Background technique [0002] At present, the PCB board with stepped groove design is mainly processed by one-time pressing, such as Chinese patent application No. CN200810142379.4, which mainly includes the following steps: providing the inner core board; providing a prepreg, and the prepreg is corresponding to the inner core board to open a ladder groove, and attach the two prepregs on both sides of the inner core board; place the corresponding silica gel sheet in the stepped groove of the prepreg; set the steel sheet on the outside of the two prepregs, and press them through a press machine, and the prepregs flow glue, Forming; take out the silicone sheet in the stepped groove to form a stepped groove. In the processing method of the stepped PCB board of the invention, the silica gel sheet is used to fill the...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/40
Inventor 李俊王彩霞陈于春
Owner SHENNAN CIRCUITS
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