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Method and apparatus for cleaning metal plate and spray nozzle for cleaning metal plate

A technology for spraying nozzles and cleaning devices, which is applied in cleaning methods and appliances, cleaning methods using liquids, spraying devices, etc., and can solve problems such as inability to obtain printing quality and clogging of metal plate meshes

Inactive Publication Date: 2011-07-20
NAKAMURA CHOKO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when the solder paste is printed by the screen printing method, the solvent of the solder paste volatilizes over time, and the solder paste gradually solidifies. In particular, the inner surface of the end of the hole is solidified and piled up, causing the mesh of the metal plate to be clogged, resulting in the problem that the desired printing quality cannot be obtained.

Method used

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  • Method and apparatus for cleaning metal plate and spray nozzle for cleaning metal plate
  • Method and apparatus for cleaning metal plate and spray nozzle for cleaning metal plate
  • Method and apparatus for cleaning metal plate and spray nozzle for cleaning metal plate

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Embodiment Construction

[0057] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0058] Such as figure 1 , figure 2 As shown, the metal plate cleaning device 10 includes: a cleaning device body 11 that sprays finely granulated alkaline water onto the metal plate 1 to clean the metal plate 1; and an alkaline water supply that supplies alkaline water. device 30.

[0059] A frame-shaped reinforcing frame 13 is integrally provided on the outer periphery of the metal plate 1, and the metal plate 1 is supported at a certain angle relative to the horizontal direction in the housing 12 of the cleaning device body 11, and sprayed on the metal plate 1. Alkaline water flows down the metal plate 1 . The inclination angle of the metal plate 1 relative to the horizontal direction can be set arbitrarily, but, in order to make the cleaning device body 11 miniaturized as much as possible, as figure 1 , Figure 12 As shown, it is preferably set at 90° with resp...

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Abstract

To provide a method of cleaning a metal plate that is an inexpensive method of reduced environmental load not using any glycol and alcohol organic solvents, and that is capable of neatly cleaning even holes of printing pattern whose width is as very small as, for example, 0.22 or 0.14 mm, and provide a relevant cleaning apparatus and a gas / liquid spray nozzle for metal plate cleaning. [MEANS FOR SOLVING PROBLEMS] The cleaning method is for a metal plate (1) used to print a cream solder on a printed wiring board. The cleaning method comprises mixing an alkali water with compressed air in an alkali water spray nozzle (14) and, while atomizing the alkali water, spraying at high velocity the atomized alkali water from the alkali water spray nozzle (14) onto the metal plate (1) to thereby attain cleaning of the metal plate (1).

Description

technical field [0001] The present invention relates to a cleaning method, a cleaning device, and a spray nozzle for cleaning a metal plate used for printing solder paste on a printed wiring board. Background technique [0002] At present, as a method of applying solder paste to a solder-adhered portion of a printed wiring board, a method of printing and applying solder paste by a screen printing method using a metal plate formed of stainless steel, nickel, or the like is widely used. However, when the solder paste is printed by the screen printing method, the solvent of the solder paste volatilizes over time, and the solder paste gradually solidifies. In particular, the inner surface of the end portion of the hole is solidified and piled up, causing clogging of the mesh of the metal plate, resulting in a problem that desired printing quality cannot be obtained. Therefore, the metal plate used in printing needs to be cleaned every certain period of time to remove the solidi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23G3/00C23G1/14B08B3/02
CPCH05K3/1216B05B1/044B05B7/045B08B3/024C23G3/00H05K3/26B05B7/0475C23G1/14B08B3/02
Inventor 深川纯二岩仓昌彦萩原康仁高木俊秀
Owner NAKAMURA CHOKO
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