Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Device for coating a plurality of closest-packed substrates arranged on a susceptor

A technology for substrates and bases, applied in coatings, gaseous chemical plating, metal material coating processes, etc., can solve problems such as gas phase loss and negative impact on the uniformity of deposited layers

Active Publication Date: 2010-03-24
AIXTRON AG
View PDF4 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Parasitic growth not only leads to undesired gas phase depletion but also has a negative impact on the uniformity of the deposited layer

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device for coating a plurality of closest-packed substrates arranged on a susceptor
  • Device for coating a plurality of closest-packed substrates arranged on a susceptor
  • Device for coating a plurality of closest-packed substrates arranged on a susceptor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] Figure 7 The interior of a reactor frame of a device for coating a plurality of substrates 3 arranged on a susceptor 1 is described. The susceptor 1 essentially consists of a graphite body with a circular upper surface lying in a horizontal plane, which upper surface forms a support surface 2 for a plurality of substrates. The base 1 has a diameter of up to 40 cm and is rotatable about an axis A of rotation.

[0021] Above the susceptor 1 there is a process chamber 14 delimited upwardly by the underside of a gas inlet member 15 . Openings may be distributed over the entire downwardly facing gas outlet face of the gas inlet member 15 in the manner of showerheads, through which openings one or more process gases enter the process chamber 14, so that the gas phase is formed spontaneously or by The heater disposed under the susceptor 1 reacts thermally active on the upper surface of the substrate. The process gas contains elements of the fourth main group or elements of...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a device for coating a plurality of substrates (3) which are regularly arranged on a bearing surface (2) of a susceptor (1) associated to a process chamber (14), wherein the bearing surface (2) forms abutment flanks (5) for the edge mounting of each substrate (3). In order to reduce the free susceptor surface to a minimum, it is proposed that the abutment flanks of the lateral walls (5) are formed by bases (4) which project from the bearing surface (2) and are separated at a distance from one another. Said bases are arranged on the corner points (10) of a honeycomb structure and have an outline essentially corresponding to an equilateral triangle with inwardly curved sides (5).

Description

technical field [0001] The invention relates to a device for coating a plurality of substrates arranged in a regular manner on a support surface of a susceptor assigned to a process chamber, the support surface providing abutment flanks for edge bonding of each substrate . Background technique [0002] DE US 5814196 describes a coating device in which the substrate is located in a groove, the edge of which matches the peripheral shape of the substrate. The bottom surface of the groove defines a support surface for the substrate. The center of the substrate is located at the corner point of the equilateral triangle. [0003] A polishing device is known from US 2003 / 0109139 A1 in which every third substrate is arranged on a substrate carrier in a planetary arrangement. [0004] DE 10 2004 009 130 A1 describes such a device for coating a plurality of substrates arranged in a regular manner on a support surface of a base assigned to a treatment chamber, which support surface ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687C30B25/12C23C16/458
CPCC23C16/4583H01L21/68771H01L21/68735H01L21/68757C23C16/458C30B25/12H01L21/687
Inventor 亚当·博伊德维克托·塞韦尔简·马尔德奥利维尔·费龙约翰尼斯·卡普勒
Owner AIXTRON AG
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com