Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

LED packaging module and preparation method thereof

A technology of LED packaging and LED chips, applied in lighting devices, lighting and heating equipment, components of lighting devices, etc., can solve the problems of poor thermal conductivity, difficulty in taking into account thermal conductivity and firmness, and poor firmness.

Inactive Publication Date: 2010-04-07
DONGGUAN WANFENG NANOMETER MATERIALS
View PDF3 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the above-mentioned existing technologies still have deficiencies, which restrict the popularization and application of LED lighting technology.
In the LED light bulbs used in the prior art, the LED chip is set by silver glue. If the amount of silver is too small, the thermal conductivity is not good; if the amount of silver is too large, the cost is high and the firmness is not good; it is difficult to balance thermal conductivity and firmness

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED packaging module and preparation method thereof
  • LED packaging module and preparation method thereof
  • LED packaging module and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The present invention will be described in further detail below in conjunction with the accompanying drawings. refer to figure 1 , figure 2 , the first embodiment of the present invention is an LED packaging module, including a substrate 101 and an LED chip 110; the substrate 101 is an AlSi alloy material, wherein the content of Al is 30%-95%, and the content of Si is 5%- 70%; the substrate 101 has a crystal-bonding surface 1011 and a wiring surface 1012, the crystal-bonding surface 1011 is arranged parallel to the wiring surface 1012, the height of the crystal-bonding surface 1011 is lower than the wiring surface 1012, and the A reflective surface 1013 is provided between the crystal bonding surface 1011 and the wiring surface 1012; a reflective film 102 is provided on the surface of the crystal bonding surface 1011, the wiring surface 1012, and the reflective surface 1013, and the reflective The film structure of the film 102 is Ni-Ag-Ni; the thickness of each laye...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to LED package used for illuminating. A substrate and an LED chip are arranged. The substrate is provided with a die bonding surface and a wiring surface. The die bonding surface and the wiring surface are arranged in parallel. The die bonding surface is lower than the wiring surface. A reflection transitional surface is arranged between the die bonding surface and the wiring surface. The LED chip is arranged on the die bonding surface. A heat sink layer is arranged between the die bonding surface and the LED chip and is made of AuSn alloys, wherein, the content of Au is 1-10% and the content of Sn is 90-99%, and the heat sink layer is 0.001-0.05mm in thickness. The invention provides an LED packaging module giving consideration to both the thermal conductivity and firmness between the LED chip and a component on the bottom layer and provides a method for preparing the LED packaging module.

Description

technical field [0001] The invention relates to an LED package for lighting. Background technique [0002] Compared with traditional lighting devices, LED street lights not only have the characteristics of good chromaticity, maintenance-free, and long life, but more importantly, they are more energy-efficient than traditional street lights. [0003] Chinese invention patent documents CN101101103, CN101101102, and CN101101107 respectively disclose a LED street lamp, the heat dissipation performance of which has reached a practical level. The above three kinds of LED street lamps represent the mainstream of LED lighting technology on the market, including tunnel lights and indoor lighting, and their core technologies are very similar to those disclosed in the above patent documents. The above-mentioned technologies all use an aluminum substrate with a printed circuit, set a plurality of single LED bulbs on the aluminum substrate, and then attach a radiator to the back of the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V19/00F21V7/22F21V29/00F21V9/10H01L23/373H01L25/075H01L33/00F21Y101/02F21K9/00F21K9/90F21V9/40F21V29/508F21V29/71F21Y115/10
CPCH01L2924/0002H01L2224/48091H01L2224/73265H01L2924/00014
Inventor 李金明
Owner DONGGUAN WANFENG NANOMETER MATERIALS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com