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Method for rolling PCB

A molding method and PCB board technology, which is applied in the direction of electrical components, printed circuit manufacturing, printed circuit, etc., can solve the problems of difficult resin flow and other problems, and achieve the effect of reducing costs and solving the problem of resin flow

Active Publication Date: 2010-04-28
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a mixed pressure molding method for PCB boards, which solves the problem that resin flow is difficult to handle in the existing mixed pressure molding process

Method used

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  • Method for rolling PCB
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Examples

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example 1

[0035] The lamination form of this example is FOIL-LAM (copper foil lamination). Also refer to figure 1 , mixed pressure molding PCB board mainly includes the following steps:

[0036] (1) Provide copper foil 1, prepreg 2, core board 3 and small board 4;

[0037] (2) Coating release agent around the surface of the copper foil 1 and the grooved part 5 of the outer core board 30 and the surface of the small plate 4, and dry to form an isolation film;

[0038] (3) Lamination molding;

[0039] (4) scrubbing;

[0040] (5) Post-processing.

[0041] refer to figure 1 (a), in the first step (1) of the mixed pressure molding method of the present invention, first prepare the copper foil 1, the prepreg 2, the core board 3 and the small board 4 according to the method of the prior art. The prepreg 2 is a resin layer, the core board 3 is an FR4 board, and the small board 4 is made of a high-frequency board. According to the shape of the small board 4 and corresponding to its pre-pr...

example 2

[0053] In this embodiment, the hybrid pressure molding method of the present invention is described by embedding a metal base in a PCB board, please refer to figure 2 , the pressure mixing method includes the following steps:

[0054] Step (1): Prepare copper foil 1, prepreg 2, core board 3 and metal base 4'. The copper foil 1 and the core board 3 correspond to the shape of the metal base 4' and slot 5 at the embedded position, refer to figure 2 (a).

[0055] Step (2): Coating the release agent around the surface of the copper foil 1 and the groove 5 of the outer core board 30 and the surface of the metal base 4', and drying to form an isolation film. This embodiment also uses Teflon solution to paint on the designated position. Drying can be carried out within a temperature range of 100 degrees centigrade by using prior art drying equipment or processes.

[0056] Step (3), lamination molding; the copper foil 1 and the core board 3 of each layer are pressed together, the...

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Abstract

The invention relates to a method for rolling a PCB, which comprises the following steps: providing laminae of the PCB and providing a rolling element; coating a parting agent at the notching part of the outmost lamina and around the surface of rolling element, and drying the parting agent to form an isolating membrane; laminating the laminae; brushing and cleaning away recessed resin and the insulating membrane; and performing post-treatment processing to manufacture the PCB. In the method, the parting agent is coated on the outer layer of the circuit board and the surface of the rolling element to form the thin isolating membrane and during pressing, the overflowing recessed resin gathers on the insolating membrane to be separated from the circuit board and completely removed from the circuit board easily. The method can completely solve the resin recession problem and reduce the cost of the removal of the recessed resin from the circuit board at the same time.

Description

technical field [0001] The invention relates to the field of PCB board molding, in particular to a mixed pressure molding method for a PCB board. Background technique [0002] The PCB board is formed by laminating the multi-layer core board and semi-cured. In the production of circuit boards, when the materials of the core boards are different, or small boards need to be laminated, or metal bases need to be pressed together, local mixed pressing, mixed lamination, and metal base buried processes are often performed. The so-called local mixed pressure means that the circuit board uses two or more different boards, and special boards (such as PTFE and other low-loss and low dielectric constant boards) are partially pressed into other boards (such as FR4, that is, glass fiber rings). oxygen resin). The so-called mixed lamination refers to boards with different layers of the same type of board. The high-level boards are partially pressed into the low-layer boards to reduce the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 袁为群张松峰孔令文彭勤卫
Owner SHENNAN CIRCUITS
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